OLED Display Bezel Reduction via Through-Hole Conductive Pads
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Organic light emitting diode display devices with traditional substrates have a significant bezel area due to conductive pads and pad lines in the non-display area, which increases the device size and reduces design sensitivity.
Innovation Solution
The solution involves a flexible substrate with a through hole for a conductive pad connected to a conductive line, an organic light emitting diode, and an encapsulation layer, with a driving circuit unit on the opposite surface, minimizing the bezel by eliminating the need for pad lines and using an anisotropic conductive film for signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive pads and pad lines are formed in the non-display area to connect the driving circuit unit, then the driving circuit can be connected to the display, but the bezel area increases and the device size increases
Solution Approach 1:
The conductive pad is moved from the traditional planar surface to a through-hole structure that extends through the substrate thickness. This dimensional change allows the pad to be positioned at the rear surface of the substrate, eliminating the need for pad lines on the front surface and thereby reducing the bezel area while maintaining electrical connection reliability.
Solution Approach 2:
The conductive pad is nested within the through-hole of the substrate, with the pad positioned inside the hole and extending to the rear surface. This nesting approach consolidates the connection structure within the substrate volume rather than requiring additional surface area, thus reducing the bezel while maintaining connectivity.
2Reliability
If conductive pads and pad lines are formed in the non-display area, then the driving circuit unit can be connected, but the device complexity increases
Solution Approach 1:
The conductive pad structure merges the connection function with the substrate structure by utilizing the through-hole as part of the pad structure. This integration eliminates the need for separate pad line traces on the substrate surface, simplifying the overall device structure while maintaining reliable electrical connection between the driving circuit and display elements.
3Area of stationary object
If the bezel area is reduced by moving conductive pads to through-holes, then the display area increases, but the manufacturing process complexity increases
Solution Approach 1:
The manufacturing process is segmented into distinct stages: first forming the through-hole in the substrate, then forming the conductive pad material within the through-hole, and finally completing the display structure. This segmentation allows each step to be optimized independently, making the complex through-hole pad fabrication manageable through systematic process breakdown.
Solution Approach 2:
The through-hole is formed in the substrate before the conductive pad material is deposited. This preliminary action of creating the hole structure first provides a defined template for subsequent pad material formation, ensuring proper pad placement and shape while simplifying the overall manufacturing sequence despite the added complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes the bezel area, reducing the overall size of the display device while maintaining a continuous screen when multiple panels are connected, enhancing design sensitivity and display continuity.
Implementation Method 1
separating the base substrate from the first substrate by irradiating a laser on the base substrate
Data Source
AI summary
An organic light emitting diode display device includes a first substrate; a conductive line formed on a first surface of the first substrate; an organic light emitting diode and an encapsulation layer on the conductive line; a second substrate on the encapsulation layer; a conductive pad connected to the conductive line and arranged in a through hole passing through the first substrate; and a driving circuit unit on a second surface opposite the first surface of the first substrate and connected to the conductive pad.