OLED Display Through-Hole Sealing With Direct Inorganic Contact

The sealing film is divided into multiple layers (first inorganic insulating layer, organic insulating layer, second inorganic insulating layer) with different properties. Each layer serves a specific function: the inorganic layers provide barrier protection against moisture and oxygen, while the organic layer provides flexibility and stress relief. This segmented structure allows the through hole to maintain design flexibility while each sealing layer addresses the reliability concern independently.

The sealing film uses a composite structure combining inorganic insulating materials (such as silicon oxide, silicon nitride) and organic insulating materials. This composite approach leverages the advantages of both material types: inorganic materials provide excellent barrier properties against moisture and oxygen penetration, while organic materials provide flexibility and adhesion. The direct contact between inorganic layers at the through hole region creates an effective seal while maintaining the overall composite structure's benefits.

The multi-layer sealing film structure serves multiple functions simultaneously: moisture barrier, oxygen barrier, mechanical flexibility, stress management, and adhesion. By integrating these functions into a single composite sealing film structure, the patent avoids the need for separate components for each function, thereby improving reliability without proportionally increasing overall device complexity.

The patent merges the protective functions against moisture and oxygen into a unified multi-layer sealing film structure that is integrated directly over the light-emitting elements and through hole. This consolidation combines multiple protective mechanisms into one cohesive structure, making the complex protection system part of the standard device architecture rather than an add-on, thus improving reliability while managing structural complexity.

The patent applies different structural qualities to different regions: the inorganic insulating layers are in direct contact specifically at the through hole region where sealing is most critical, while other regions may have the organic layer in between. This local variation in structure allows the manufacturing process to focus precision requirements only where absolutely necessary (at the through hole seal), rather than requiring perfect alignment throughout the entire sealing film structure.

The organic insulating layer acts as an intermediary that can be selectively present or absent in different regions. In areas where precise alignment is difficult to achieve, the organic layer provides a tolerance buffer that still maintains effective sealing. This intermediary layer mediates between the manufacturing precision limitations and the sealing effectiveness requirements, allowing direct inorganic layer contact only where manufacturing can reliably achieve the necessary alignment.