OLED Display Panel Through Holes for Thin Film Package Adhesion
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Solution Overview
Problem
OLED display panels face defects due to the peeling off of thin film packages caused by stress differences between the thin film packages and the substrate during manufacturing, primarily due to temperature variations, leading to inadequate protection against water vapor and oxygen.
Innovation Solution
The OLED display panel incorporates a substrate with an OLED device layer and a thin film package layer that includes through holes of varying depths and locations, allowing the thin film package layer to extend and attach securely to the OLED device layer, comprising a stack of organic and inorganic layers, thereby enhancing attachment force and preventing peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thin film packages are used to block water vapor and oxygen, then protection against erosion is improved, but stress differences cause the thin films to peel off
Solution Approach 1:
The thin film package is divided into multiple layers including inorganic layers (such as aluminum oxide, aluminum nitride) and organic layers (such as silicon oxide, silicon nitride). This segmented multi-layer structure distributes the stress more evenly and prevents peeling by creating a gradient of stress resistance across different material properties.
Solution Approach 2:
The patent employs composite material structures combining different inorganic and organic thin film layers. Each layer is selected for specific properties: inorganic layers provide barrier function against water vapor and oxygen, while organic layers provide stress buffer and adhesion. This composite approach resolves the contradiction between protection and attachment strength.
2Strength
If through holes are added to enhance attachment, then attachment force is improved, but manufacturing complexity increases
Solution Approach 1:
Through holes are pre-formed in the substrate before depositing the thin film package layers. This preliminary action allows the thin film materials to extend into the holes during deposition, creating mechanical interlocking and enhanced adhesion without requiring complex post-processing steps. The holes are strategically positioned and sized to maximize attachment while minimizing interference with the display area.
Data Source
AI summary
The display panel of the present disclosure includes a substrate; an OLED device layer disposed on the substrate and having at least one through hole defined thereon; and a thin film package layer covering the OLED device layer and extending to the at least one through hole. As such, the thin film package layer can be attached to the OLED device layer. Attachment force of the thin film package layer can be enhanced by defining the through hole(s) in the OLED device layer and filling the through hole(s) with the thin film package layer, thereby avoiding phenomenon that films are peeled off.