OLED Touch Display Panel Via Hole Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing active matrix organic light-emitting diode (AMOLED) touch display panels with on-cell touch sensors are bulky and heavy due to the placement of the touch module on the top surface of the packaging substrate, making it difficult to reduce the overall thickness and weight of the display panel.
Innovation Solution
The OLED touch display panel design features a touch electrode pattern on the bottom surface of the packaging substrate with conductive lines forming one-to-one connections through via holes to a touch control chip on the array substrate, allowing for thinner substrates and reduced volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the touch module is placed on the top surface of the packaging substrate, then the touch sensing function is achieved, but the overall thickness and weight of the display panel increase
Solution Approach 1:
The patent relocates the touch control chip from the top surface (z-dimension) to the array substrate plane (x-y dimension), specifically placing it in the packaging region. This dimensional repositioning eliminates the need for vertical stacking, thereby reducing the overall thickness and weight of the display panel while preserving touch sensing functionality through the via-hole connection structure
2Reliability
If the touch module is placed on the top surface of the packaging substrate, then the touch sensing function is achieved, but the overall thickness of the display panel increases
Solution Approach 1:
The patent repositions the touch control chip to the array substrate plane and uses via holes to establish electrical connections, transitioning from a vertical stacking architecture to a planar integration architecture. This dimensional change eliminates the need for thick packaging substrates, thereby reducing the overall thickness of the display panel
3Reliability
If the touch control chip is placed on the packaging substrate, then the electrical connection is established, but the packaging substrate thickness cannot be reduced
Solution Approach 1:
The patent extracts the touch control chip from the packaging substrate and relocates it to the array substrate. This separation allows the packaging substrate to be thinned down without compromising the electrical connection, as the via holes provide the necessary conductive pathways between the touch electrodes and the relocated chip
4Reliability
If the via holes are formed to connect conductive lines and touch lines, then the electrical connection is achieved, but the fabrication process complexity increases
Solution Approach 1:
The patent merges the via-hole formation process with the existing OLED fabrication工艺流程. The via holes are formed during the same deposition and patterning steps used for creating the OLED structure and conductive lines, thereby integrating multiple functions into a single fabrication sequence and minimizing additional process complexity
Data Source
AI summary
The present disclosure provides an organic light-emitting diode (OLED) touch display panel. The OLED touch display panel includes a packaging substrate, having a touch sensing region and a touch pin line region on a first surface of the packaging substrate, the touch sensing region including a plurality of touch electrodes, the touch pin line region including a plurality of touch lines forming one-to-one electrical connections with the touch electrodes; and an array substrate, having a display region, a connecting region, and a packaging region on a first surface of the array substrate, the display region having an OLED structure, the connecting region having a plurality of conductive lines connectable to a touch control chip. The first surface of the packaging substrate and the first surface of the array substrate are facing each other, the conductive lines forming one-to-one connection with the touch lines through a plurality of via holes.