Stretchable OLED Encapsulation via Undercut Structures

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Solution Overview

Problem

Current encapsulation technologies for stretchable OLED panels are limited by high pixel density, resulting in large gaps between subpixels and low pixel density, which hinders the stretchability and performance of the display panel.

Innovation Solution

The implementation of undercut structures in both island and chain regions of the display panel, with an encapsulation layer covering these structures, allows for a single encapsulation process that reduces gaps between subpixels and increases pixel density without the need for individual subpixel encapsulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If individual encapsulation is performed for each subpixel using fine metal mask spreading process, then protection from water and oxygen is improved, but manufacturing complexity increases and pixel density is limited

Engineering Contradiction:
Improveprotection from water and oxygenVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the encapsulation of multiple subpixels into a single unified encapsulation layer that covers the entire island region. Instead of performing individual encapsulation for each subpixel using separate fine metal mask processes, a single encapsulation layer is formed that simultaneously protects all subpixels, thereby reducing manufacturing complexity while maintaining protection reliability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation layer serves multiple functions simultaneously: it protects all subpixels from water and oxygen, defines the island region boundary, and enables higher pixel density through the belt-shaped chain region design. This multi-functional approach eliminates the need for separate individual encapsulation processes for each subpixel.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If individual encapsulation is performed for each subpixel, then protection from water and oxygen is improved, but gaps between subpixels increase and pixel density decreases

Engineering Contradiction:
Improveprotection from water and oxygenVSAvoidpixel density
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

By combining the encapsulation of multiple subpixels under a single encapsulation layer, the patent eliminates the gaps that would exist between individually encapsulated subpixels. The unified encapsulation layer creates continuous coverage across all subpixels in the island region, maximizing the usable display area and increasing pixel density while maintaining protective functionality.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If fine metal mask spreading process is used for encapsulation, then individual subpixel protection is achieved, but the process is incapable of coping with high pixel distribution density

Engineering Contradiction:
Improveindividual subpixel protectionVSAvoidpixel distribution density capability
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent merges the encapsulation approach from individual subpixel-level to region-level encapsulation. By forming a single encapsulation layer that covers the entire island region containing multiple subpixels, the process can accommodate high pixel distribution density without being constrained by the limitations of fine metal mask spreading processes required for individual subpixel encapsulation.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of manufacture

If blank frame region is maintained in packaging process, then manufacturing simplicity is preserved, but pixel density is reduced

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidpixel density
Core Design Contradiction:
Ease of manufactureVSQuantity of substance

Solution Approach 1:

The patent extracts and eliminates the blank frame region from the traditional packaging structure. By removing this non-functional space and extending the belt-shaped chain region to the edges of the substrate, the design maximizes the area available for subpixel distribution, thereby increasing pixel density without significantly complicating the manufacturing process.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS20230403889A1Display panel and manufacturing method thereof
Publication Date: 2023.12.14 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
  • US20230403889A1 patent drawing
  • US20230403889A1 patent drawing
  • US20230403889A1 patent drawing

AI summary

The present application provides a display panel and a manufacturing method thereof. The display panel includes a plurality of display units. Each of the display units includes an island region and a chain region surrounding the island region. In at least one of the display units, the display panel includes an array substrate, a plurality of undercut structures, and an encapsulation layer. The undercut structures include a first undercut structure defined in the island region and a second undercut structure defined in the chain region.