OLED Display Connection Wiring Layout for Bonding Damage Tolerance
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Solution Overview
Problem
Signal transmission failures occur in OLED display devices due to damage to insulating layers during the bonding process, leading to compromised signal transmission wiring.
Innovation Solution
A multi-wiring structure with a stem wiring and branch wirings on the same layer, covered by an inorganic insulating layer and partially exposed by an organic insulating layer, ensures electrical connectivity and protection from environmental factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single wiring structure is used for signal transmission, then the device complexity is reduced, but the reliability of signal transmission deteriorates due to damage to insulating layers during bonding processes
Solution Approach 1:
The single wiring is segmented into multiple parallel wirings (first wiring and second wiring) that extend in the same direction. This segmentation allows the signal transmission path to be divided into multiple independent routes, so that damage to one wiring does not necessarily cause complete signal transmission failure, thereby improving reliability while maintaining relatively simple structure
Solution Approach 2:
The patent applies beforehand cushioning by creating redundant wiring paths before any damage can occur. The multiple parallel wirings are designed in advance to compensate for potential insulating layer damage during bonding processes, ensuring that even if one wiring is compromised, the signal can still be transmitted through the remaining wirings
2Object-affected harmful factors
If insulating layers are applied to protect wirings, then the protection from environmental factors is improved, but the manufacturing precision deteriorates due to damage during frit bonding, driving circuit board attachment, and substrate cutting processes
Solution Approach 1:
The patent applies local quality by providing different levels of insulation protection at different locations. The first insulating layer covers the entire wiring structure, while the second insulating layer selectively covers only portions of the wirings in the bonding region. This localized approach ensures adequate protection where needed while minimizing the risk of damage during subsequent manufacturing processes
3Object-affected harmful factors
If the organic insulating layer covers the entire wiring, then the protection from corrosion is improved, but the ease of operation deteriorates due to difficulty in accessing pad electrodes for external circuit board connection
Solution Approach 1:
The patent applies the taking out principle by selectively removing or not forming the second insulating layer at specific locations where pad electrodes need to be accessed. This creates exposed regions that allow external circuit boards to connect to pad electrodes while the rest of the wiring remains protected by the insulating layers, thus balancing protection and accessibility
Data Source
AI summary
Provided is a display device. The display device includes a first substrate; a second substrate disposed facing the first substrate; a sealing member disposed between and surrounding the first substrate and the second substrate and separates a space inside the sealing member from a space outside the sealing member; a pad electrode disposed on the first substrate in the space outside the sealing member; and a connection wiring disposed on the first substrate over the space inside the sealing member and the space outside the sealing member and electrically connected to the pad electrode, wherein the connection wiring comprises a multi-wiring structure located in the space outside the sealing member.