Olefin-Acrylate Thermal Interface Material for Stable Heat Transfer
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Solution Overview
Problem
Conventional thermal interface materials face issues such as silicone leakage, structural instability at high temperatures, and unpredictable thermal conductivity due to varying filler sizes, leading to high thermal resistance and reduced operable time.
Innovation Solution
A thermal interface material comprising an olefin-acrylate copolymer with a melt flow index of 110-500 g/10 min and 25-35% volume, combined with thermally conductive fillers and a highly dispersible titanium-containing oxide filler, ensuring stable adhesion and reduced thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If phase change material is used to reduce thermal resistance, then thermal conductivity is improved, but the material flows out when temperature exceeds melting point
Solution Approach 1:
The patent changes the material composition from conventional phase change materials to olefin-acrylate copolymer with specific melt flow index (110-500 g/10min) and melting point (70-90°C). This parameter optimization ensures the material remains stable and non-flowing at operating temperatures while maintaining good thermal conductivity and adhesion properties.
2Temperature
If two thermally conductive fillers with different diameters are used to increase filling ratio, then thermal conductivity is improved, but the formulation becomes highly complex
Solution Approach 1:
The patent uses a composite filler system comprising aluminum nitride (60-80 wt%) and aluminum oxide (20-40 wt%). This composite approach achieves high filling ratio (65-75 vol%) and excellent thermal conductivity without requiring complex multi-size filler combinations, simplifying the formulation while maintaining performance.
3Ease of manufacture
If silicone-containing resin is used as matrix, then ease of manufacture is improved, but silicone oil leakage occurs during operation
Solution Approach 1:
The patent extracts and eliminates silicone-containing resins from the thermal interface material composition, replacing them with olefin-acrylate copolymer. This removal of the harmful component (silicone) prevents oil leakage during operation while maintaining the material's processability and manufacturing ease through the copolymer's inherent properties.
4Quantity of substance
If filler particles with various sizes are used, then filling ratio is increased, but thermal resistance remains high due to poor contact
Solution Approach 1:
The patent employs a homogeneous filler size distribution with aluminum nitride (6-12 μm) and aluminum oxide (3-8 μm) particles. This uniform size distribution, combined with the olefin-acrylate copolymer matrix, ensures good filler dispersion and intimate contact between particles, reducing thermal resistance while achieving high filling ratio without requiring multi-size particle combinations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The material maintains structural integrity and high thermal conductivity, with reduced thermal resistance and increased operable time, even under extreme conditions, without the need for additives like organic solvents or cross-linking agents.
Implementation Method 1
The melting point of a phase change material is often below 70° C. When the environmental temperature is higher than its melting point, the phase change material changes into the liquid phase
Implementation Method 2
The olefin-acrylate copolymer has a melting point lower than 70° C. and the melt flow index ranging from 110 g/10 min to 500 g/10 min
Implementation Method 3
the thermal interface material conventionally includes two thermally conductive fillers with different mean or median diameters (referred to as 'first thermally conductive filler' and 'second thermally conductive filler' hereinafter), thereby increasing the filling ratio
Data Source
AI summary
A thermal interface material includes a thermally melting material and an inner filler. The thermally melting material includes an olefin-acrylate copolymer having a melt flow index higher than 110 g/10 min. The inner filler has a plurality of thermally conductive fillers and a highly dispersible filler. The total volume of the thermal interface material is calculated as 100%, with the olefin-acrylate copolymer accounting for 25% to 35%, and the thermally conductive fillers and the highly dispersible filler accounting for 65% to 75%.