Silane-Modified Olefin Encapsulant for Low-Temperature Lamination
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Solution Overview
Problem
Existing encapsulants for optoelectronic devices face challenges in achieving high light transmittance and low haze values while maintaining excellent adhesive strength and processability, particularly during low-temperature lamination, which is essential for efficient and cost-effective manufacturing.
Innovation Solution
A modified olefin resin with two crystallization temperatures and a specific resin composition, including an ethylene/α-olefin copolymer, unsaturated silane compounds, and amino silane, is developed through a reactive extrusion process, allowing for low-temperature lamination and enhanced optical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional encapsulant resins are used, then adhesive strength can be maintained, but light transmittance is reduced and haze value increases
Solution Approach 1:
The patent modifies the chemical composition parameters of the encapsulant resin by incorporating specific silane-modified polyolefins and controlling the ratio of crystalline to amorphous phases, achieving optimal balance between light transmittance and adhesive strength
Solution Approach 2:
The patent creates a composite resin system combining silane-modified polyolefin with specific additives and fillers, where each component contributes to either optical properties or adhesive performance, resolving the contradiction between these two requirements
2Reliability
If high lamination temperature is used, then adhesive strength is improved, but manufacturing cost and energy consumption increase
Solution Approach 1:
The patent changes the chemical composition parameters of the resin to include reactive silane groups that form strong bonds at lower temperatures, eliminating the need for high-energy lamination processes while maintaining adhesive strength
3Reliability
If high lamination temperature is used, then adhesive strength is improved, but manufacturing efficiency is reduced
Solution Approach 1:
The patent modifies the lamination temperature parameter to a lower range (60-120°C) through chemical composition changes, which reduces cycle time and energy consumption while maintaining bond strength, thereby improving manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified olefin resin ensures high light transmittance, low haze, and strong adhesion to both glass substrates and back sheets, even at low lamination temperatures, thereby improving the manufacturing efficiency and long-term durability of optoelectronic devices.
Implementation Method 1
a polyolefin resin having two crystallization temperatures (Tc) and one melting temperature (Tm)
Implementation Method 2
one melting temperature (Tm)
Data Source
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AI summary
Provided are a polyolefin resin having two crystallization temperatures, a resin composition including the polyolefin resin, an encapsulant film, a method for manufacturing the encapsulant for an optoelectronic device, and an optoelectronic device, in which the encapsulant having high light transmittance and low haze value can be provided even under the condition of low lamination, and the resin composition including the polyolefin resin can be used for manufacturing various encapsulants for an optoelectronic device, thereby providing excellent adhesive strength with the front substrate and back sheet included in the device, especially, a long-term adhesion property and improved heat resistance.