Oleophobic Film Formation on Electronic Components
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Solution Overview
Problem
Existing electronic component manufacturing methods, such as those described in Japanese Unexamined Patent Applications 2000-277373 and 2009-85589, face challenges in forming a uniform oleophobic film over the entire surface of electronic components due to insufficient spacing between the component and the mounting surface, leading to incomplete gas flow around the component.
Innovation Solution
An electronic component manufacturing method and film forming apparatus that utilize a component holder with a recessed accommodation space to allow the electronic component to be inserted in an upstanding or inclined posture, ensuring that gas containing an oleophobic material can flow around and uniformly contact the component's surfaces, forming a uniform oleophobic film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic component is mounted on the mounting surface of the ceramic container, then the component is securely positioned, but insufficient spacing is ensured between the contact region and the mounting surface, preventing uniform gas flow around the component
Solution Approach 1:
A holder is introduced as an intermediary component between the electronic component and the gas flow system. The holder includes a receiving portion with a recessed shape that positions the component at an optimal distance from the gas source, ensuring uniform gas distribution around all surfaces including the bottom surface, thereby achieving uniform oleophobic film formation while maintaining component stability
Solution Approach 2:
The receiving portion is designed with a recessed shape that extends in the depth direction, creating a three-dimensional space around the component. This dimensional approach allows gas to flow uniformly around all surfaces of the component, including the bottom surface, which would otherwise be inaccessible in a flat mounting configuration
2Manufacturing precision
If the baffle plate is disposed to regulate the atmosphere gas such that the gas passes just above the electronic component, then the organic substance is effectively removed, but the gas cannot be supplied in a way of flowing around the entirety of the electronic component
Solution Approach 1:
The receiving portion creates a three-dimensional recessed space that allows gas to access and flow around all surfaces of the component from multiple directions, including the bottom surface. This dimensional approach overcomes the limitation of the baffle plate configuration which only provided top-down gas flow
Solution Approach 2:
The gas flow path is segmented into multiple regions by the recessed structure of the receiving portion, allowing gas to flow around different surfaces of the component separately and uniformly, ensuring comprehensive surface treatment of all component surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables even surface treatment of electronic components, preventing conductive paste spread and ensuring reliable prevention of short-circuiting between outer electrodes, thereby enhancing the manufacturing process's effectiveness in forming uniform oleophobic films.
Implementation Method 1
forming an oleophobic film over the surfaces of the electronic component base body by bringing gas containing an oleophobic material into contact with the surfaces of the electronic component base body
Data Source
AI summary
An electronic component manufacturing method includes inserting an electronic component base body, which has a substantially rectangular parallelepiped shape and paired opposing end surfaces, paired opposing lateral surfaces connecting the end surfaces, and paired opposing principal surfaces perpendicular to the end surfaces and the lateral surfaces and connecting the end surfaces, in a receiving portion of a component holder. The receiving portion defining an accommodation space that is capable of receiving the electronic component base body, forming an oleophobic film over the surfaces of the electronic component base body by exposing the surfaces of the electronic component base body inserted in the receiving portion to gas containing an oleophobic material, taking out the electronic component base body, which includes the oleophobic film formed thereon, from the receiving portion, and forming outer electrodes on the electronic component base body having been taken out.