10G OLT Transceiver Chip with EML Laser and Fast Recovery Circuit
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Solution Overview
Problem
Existing OLT terminals based on GPON standards have limited transmission rates, which fail to meet the increasing demands for higher speed and efficiency in optical communication, particularly due to limitations in DFB lasers and high power consumption in EML lasers used for longer distances.
Innovation Solution
A 10G rate OLT terminal transceiver integrated chip is developed using XGSPON protocol with an EML laser, incorporating a burst mode receiver, continuous mode transmitter, digital control unit, and power module, featuring a fast recovery circuit, clock data recovery, and embedded power management to optimize signal transmission and power efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If DFB laser is used for transmission, then transmission distance is limited to 10 km, but production cost is lower and device size is smaller
Solution Approach 1:
The patent changes the fundamental operating parameters of the laser system by switching from DFB laser to EML laser, which operates in continuous mode rather than burst mode. This parameter change enables transmission distances exceeding 100 km while maintaining cost-effectiveness through integrated chip design and power management optimizations.
2Length of moving object
If EML laser is used to increase transmission distance beyond 100 km, then transmission distance is improved, but power consumption increases significantly
Solution Approach 1:
The patent implements dynamic power management by introducing a power management module that dynamically adjusts the working states of the EML laser and TEC based on transmission distance requirements. The system can switch between different operational modes (continuous transmission, burst transmission, or standby) to optimize power consumption while maintaining the capability for ultra-long distance transmission when needed.
Solution Approach 2:
The patent segments the power management function into distinct control modules that independently manage the EML laser driver, TEC, and overall power distribution. This segmentation allows for granular power control where only necessary components are activated based on current transmission needs, reducing overall power consumption while maintaining ultra-long distance transmission capability.
3Length of moving object
If EML laser with TEC is used to control working temperature, then transmission distance is improved, but device complexity and power consumption increase
Solution Approach 1:
The patent merges the EML laser, TEC temperature control module, and power management functions into a single integrated chip. This integration reduces device complexity by eliminating separate components and interconnections, while maintaining the temperature control capability necessary for stable EML laser operation over ultra-long transmission distances.
Solution Approach 2:
The patent implements self-service temperature control through an integrated temperature sensor and feedback control circuitry that automatically monitors and adjusts the TEC operation based on real-time temperature conditions. This self-regulating mechanism reduces the need for external control systems and simplifies the overall device architecture while ensuring stable EML laser performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases downlink and uplink data rates to 10 Gbps, improves power management, and enhances communication protocol compliance, enabling stable ultra-long-distance optical signal transmission while reducing overall power consumption.
Implementation Method 1
The light intensity is changed by the external electro-absorption modulator using the electro-absorption effect to achieve the purpose of signal modulating
Implementation Method 2
uses its integrated TEC (Thermo Electric Cooler) to control the work temperature
Data Source
AI summary
A 10G rate OLT terminal transceiver integrated chip based on XGSPON with EML laser includes: a burst mode receiver RX which processes amplitude detection, and outputs the signal whose amplitude and waveform pulse width met the threshold requirements to a host, and comprises a fast recovery module to discharge charges in an AC coupling capacitor to achieve multi-packet transmission without mutual interference and to meet the timing sequence requirement of the XGSPON protocol; a continuous mode transmitter TX which receives the electrical signal attenuated by a PCB board, and selects a bypass BYPASS path or a clock data recovery CDR path according to a degree of attenuation to drive the EML laser; a digital control unit DIGIITAL which communicates with the host and provides control signals to the burst mode receiver RX and the continuous mode transmitter TX; and a power module POWER.