Omnidirectional LED Light Wire Heat Dissipation

The patent removes the FPC substrate from the LED structure, extracting the problematic component that caused poor heat dissipation and low temperature resistance. The LED chip is mounted directly on the heat dissipation component, eliminating the thermal bottleneck introduced by the FPC substrate while maintaining manufacturing simplicity through direct mounting techniques.

The patent employs composite material structures by combining the LED chip with a specialized heat dissipation component that integrates multiple functional layers. This composite structure incorporates materials with high thermal conductivity for heat dissipation while maintaining electrical insulation and mechanical strength, thereby achieving high temperature resistance without sacrificing ease of manufacture.

The FPC substrate is extracted and removed from the structure, eliminating its detrimental effect on heat dissipation. The LED chip is directly mounted on the heat dissipation component, creating a direct thermal pathway that significantly improves heat dissipation performance while keeping the manufacturing process simple through direct bonding techniques.

The patent replaces the mechanical FPC substrate structure with a direct thermal conduction system. Instead of relying on the FPC's mechanical support function, the design uses a dedicated heat dissipation component with high thermal conductivity materials and direct thermal contact interfaces, substituting the mechanical support system with an optimized thermal management system that achieves superior heat dissipation.

The FPC substrate is extracted and removed from the LED structure, eliminating the source of premature failure. By directly mounting the LED chip on the heat dissipation component, the design removes the thermal stress and degradation mechanisms associated with FPC substrates, thereby extending the service life of the flexible filament while maintaining ease of manufacture through direct bonding processes.

The patent uses composite material construction with high-temperature-resistant and high-stability materials in the heat dissipation component and sealing structure. This composite approach creates a more durable assembly that resists thermal cycling degradation and extends operational life, while the modular design maintains ease of manufacture through standardized mounting procedures.