Omnidirectional Sensor Package With Fixed Four-Element Array

Solution Overview

Problem

Conventional automotive sensors require mechanical rotation assemblies for omnidirectional detection, increasing manufacturing costs and size.

Innovation Solution

An omnidirectional sensor package incorporating four sensor elements, each with a detection range greater than 90 degrees, integrated within a single package using semiconductor packaging techniques, eliminating the need for mechanical rotation assemblies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a mechanical rotation assembly is used to enable omnidirectional detection, then the sensor can detect in all directions, but the manufacturing cost and device size increase

Engineering Contradiction:

Improveomnidirectional detection capabilityVSAvoidmechanical rotation assembly

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The sensor device is divided into multiple independent sensor elements (first substrate sensor element, second substrate sensor element, first side sensor element, second side sensor element) positioned at different orientations. Each sensor element detects signals from its specific direction, and together they provide omnidirectional coverage without requiring mechanical rotation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from a single unidirectional sensor that requires mechanical rotation in the horizontal plane to a multi-element arrangement that spans multiple spatial dimensions. Sensor elements are positioned on different substrates (first substrate, second substrate) and side surfaces, creating a three-dimensional sensing array that achieves omnidirectional detection through spatial distribution rather than mechanical movement.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If a mechanical rotation assembly is used to enable omnidirectional detection, then the sensor can detect in all directions, but the manufacturing cost increases

Engineering Contradiction:

Improveomnidirectional detection capabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The sensor device is divided into multiple independent sensor elements (first substrate sensor element, second substrate sensor element, first side sensor element, second side sensor element) positioned at different orientations. Each sensor element detects signals from its specific direction, and together they provide omnidirectional coverage without requiring mechanical rotation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention replaces the mechanical rotation system with a static multi-element sensor array. Instead of using motors, mirrors, and mechanical components to rotate a single sensor, the system uses multiple fixed sensor elements positioned at different orientations, eliminating the need for complex mechanical assemblies and reducing manufacturing costs.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If a mechanical rotation assembly is used to enable omnidirectional detection, then the sensor can detect in all directions, but the device size increases

Engineering Contradiction:

Improveomnidirectional detection capabilityVSAvoidsensor device size

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The sensor elements are arranged in a compact configuration where the first substrate sensor element and second substrate sensor element are positioned between the first and second substrates, and the side sensor elements are mounted vertically between the substrates. The encapsulant layer and clear molds integrate and protect all components within a compact package, nesting multiple sensing functions within a single integrated device structure.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The invention transitions from a single unidirectional sensor that requires mechanical rotation in the horizontal plane to a multi-element arrangement that spans multiple spatial dimensions. Sensor elements are positioned on different substrates (first substrate, second substrate) and side surfaces, creating a three-dimensional sensing array that achieves omnidirectional detection through spatial distribution rather than mechanical movement.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20250228032A1Omnidirectional sensor package and a method for making the same

Publication Date: 2025.07.10 STATS CHIPPAC LTD

AI summary

A sensor package comprises a first substrate and a second substrate. A first substrate sensor element is mounted on an inner surface of the first substrate and between the first substrate and the second substrate, and a second substrate sensor element is mounted on an inner surface of the second substrate and between the first substrate and the second substrate. A first side sensor element and a second side sensor element are mounted vertically between the first substrate and the second substrate, wherein the first and second side sensor elements have respective sensing areas facing away from each other and outwards of the sensor package, and wherein the first and second side sensor elements are electrically coupled to at least one of the first substrate and the second substrate. A first side clear mold and a second side clear mold are formed to cover the respective sensing areas of the first and second side sensor elements. An encapsulant layer is formed between the first substrate and the second substrate to encapsulate the first substrate sensor element, the second substrate sensor element and the first and second side sensor elements.