On-Chip 55-64 GHz Antenna for IC Wireless Interconnects
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Solution Overview
Problem
Current wireless communication systems face challenges in integrating efficient antenna structures within the limited space of integrated circuits (ICs), as traditional three-dimensional antennas cannot be implemented in the two-dimensional space of ICs or printed circuit boards, and existing two-dimensional antennas are too large to fit on-chip due to size constraints.
Innovation Solution
The development of integrated circuit antenna structures that include a plurality of RF transceivers and antenna structures on-die or on-package substrates, utilizing electromagnetic properties to operate within specific frequency bands, such as 55 GHz to 64 GHz, to enable wireless communication between ICs without the need for conductive traces on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional three-dimensional antennas are used, then antenna efficiency is improved, but they cannot be implemented in the two-dimensional space of ICs or printed circuit boards
Solution Approach 1:
The patent transitions from three-dimensional antenna structures to two-dimensional planar antenna designs that can be fabricated on IC substrates or printed circuit boards. This dimensional change enables antenna integration in planar space while maintaining functional performance through optimized two-dimensional radiation patterns and impedance characteristics.
Solution Approach 2:
The invention extracts the essential antenna radiation function from traditional three-dimensional structures and implements it through planar conductive elements on two-dimensional substrates. This extraction allows the antenna to be integrated directly into the IC or PCB without requiring three-dimensional space, resolving the conflict between efficiency and spatial implementation.
2Area of stationary object
If existing two-dimensional antennas are designed to fit on-chip, then area is reduced, but they become too large to fit within IC space constraints
Solution Approach 1:
The patent divides the antenna structure into multiple segments or elements that can be distributed across the substrate. This segmentation allows the total antenna area to be reduced while maintaining radiation performance through constructive interference of the segmented elements, enabling on-chip integration within tight space constraints.
Solution Approach 2:
The invention employs nested or folded antenna configurations where conductive elements are arranged in space-efficient patterns that maximize the effective radiating length within a minimal footprint. This nesting approach allows the antenna to fit within IC area constraints while maintaining adequate radiation characteristics.
3Adaptability or versatility
If antenna structures are integrated on-die or on-package substrates, then wireless communication capability is enabled, but manufacturing precision requirements increase
Solution Approach 1:
The patent designs antenna structures with parameters (such as conductor width, spacing, and pattern geometry) that are optimized for standard IC fabrication processes. By selecting parameters that align with typical manufacturing tolerances, the invention enables wireless communication capability while maintaining compatibility with existing manufacturing precision capabilities.
Solution Approach 2:
The invention employs standard IC fabrication techniques and materials for antenna construction, making the antenna manufacturing process universal with the rest of the IC fabrication workflow. This universality reduces the need for specialized high-precision processes while maintaining antenna performance through careful design within standard manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient wireless communication between ICs, supporting local and remote communications, including high data rate transmissions, by configuring antenna structures to operate within specific frequency bands, thereby overcoming the size limitations and enabling advanced communication protocols.
Implementation Method 1
an antenna structure (38, 40, 42, 44, 72, 74, 282, 290) and a radio frequency (RF) transceiver (46, 48, 50, 52, 76, 286)
Data Source
AI summary
An integrated circuit (IC) includes a package substrate, a die, and an antenna structure. The die includes a functional circuit module and a radio frequency (RF) transceiver that processes inbound and outbound RF signals. The antenna structure is coupled to the RF transceiver and is on the die and/or the package substrate. The antenna structure receives the inbound RF signal within a frequency band of approximately 55 GHz to 64 GHz and transmits the outbound RF signal within the frequency band.