On-Chip Memory Debug Module for 3D-IC Post-Fabrication Error Localization
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Solution Overview
Problem
Post-fabrication debug of highly integrated 2D- and 3D-ICs with traditional methodologies is inefficient, requiring significant engineering effort and time, especially due to challenges in bug localization in 3D stacking and dense integration systems.
Innovation Solution
A post-fabrication debug framework that includes a design-for-debug architecture with a debug module connected to the IC's functional bus, generating compact signatures from trace signals and comparing them to expected signatures, allowing for efficient identification and storage of erroneous intervals in on-chip memory, enabling single-iteration debugging and online error checking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional post-fabrication debug methodologies are used for highly integrated 2D- and 3D-ICs, then bug localization can be performed, but the debug session time is significantly increased and engineering effort is substantially required
Solution Approach 1:
The patent applies preliminary action by pre-calculating and storing expected signatures in on-chip memory before the actual debug session. During debugging, measured signatures are directly compared against these pre-stored expected signatures, eliminating the need for time-consuming iterative debugging and significantly reducing debug session time while maintaining accurate bug localization capability
Solution Approach 2:
The patent creates compact signatures that copy essential characteristics of trace signals into a condensed form. These signature copies are stored in on-chip memory and can be rapidly compared during debugging, enabling fast bug localization without requiring analysis of the full, voluminous trace signal data, thus reducing debug time while preserving measurement precision
2Reliability
If traditional debug methodologies are applied to 3D stacking and dense integration systems, then system functionality can be verified, but the engineering effort and time-to-market are significantly increased
Solution Approach 1:
Expected signatures are pre-calculated and loaded into on-chip memory before production testing, enabling rapid comparison during actual debugging. This preliminary preparation eliminates iterative debugging cycles and significantly accelerates the verification process for 3D stacked and densely integrated systems, improving time-to-market while ensuring reliable functionality verification
Solution Approach 2:
The debug module performs self-service by autonomously comparing measured signatures against pre-stored expected signatures and automatically identifying mismatches. This self-contained approach eliminates the need for extensive external engineering intervention during debugging, reducing engineering effort and accelerating time-to-market for complex integrated systems while maintaining verification reliability
3Loss of information
If full trace data is stored during debugging, then complete analysis is possible, but memory resources are consumed and debug efficiency is reduced
Solution Approach 1:
The patent extracts only the essential characteristics of trace signals into compact signatures, storing only these condensed representations in on-chip memory rather than the full trace data. This extraction approach preserves the critical information needed for bug localization while dramatically reducing memory consumption and improving debug efficiency through faster comparison operations
Solution Approach 2:
The patent applies local quality by storing complete trace data only for intervals where signature mismatches are detected, while discarding or not storing data from intervals where signatures match. This selective storage approach ensures that complete analysis data is preserved for problematic intervals without wasting memory resources on already-verified intervals, thereby improving debug efficiency while maintaining necessary information completeness
Data Source
AI summary
A post-fabrication debug and on-line error checking framework for 2D- and 3D-ICs with integrated memories is described. A design-for-debug (DfD) architecture can include, for an IC with on-chip memory, a debug module connected to a functional bus of the IC. The debug module receives trace data for an interval, generates compact signatures based on the received data, and compares these signatures to expected signatures. Intervals containing erroneous trace data can be identified by the debug module and stored in on-chip memory. A single iteration of signal tracing for debug testing between automated test equipment and the IC is possible.