On-Chip EBG Structure for High-Frequency Noise Suppression

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Solution Overview

Problem

As clock rates increase and operating voltages decrease in high-speed systems-on-chips (SoCs) and systems-in-packages (SiPs), signal integrity (SI) and power integrity (PI) are compromised due to electromagnetic interference (EMI), power fluctuations, and ground bounce noise (GBN) on power and ground planes, with existing solutions either being costly or ineffective at high frequencies.

Innovation Solution

An electromagnetic bandgap (EBG) structure is integrated within SoCs and SiPs, comprising a power mesh and a ground mesh stacked in the back end of line (BEOL) region with an inductor and capacitor, providing a low inductance noise path to filter noise effectively at high frequencies without increasing area, and allowing for adjustable center frequency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If existing noise suppression solutions are implemented, then noise filtering is improved, but cost increases or effectiveness at high frequencies deteriorates

Engineering Contradiction:

Improvenoise suppressionVSAvoideffectiveness at high frequencies

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent changes the electrical parameters of the power and ground planes by integrating EBG structures with specific unit cell geometries and material properties. These parameter changes create frequency-selective noise suppression characteristics that are effective at high frequencies while maintaining low cost and high reliability through standard semiconductor fabrication processes

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures by combining EBG unit cells with conventional power distribution network materials. The EBG structures are formed using stacked conductive layers separated by dielectric materials, creating a composite electromagnetic structure that provides superior noise suppression at high frequencies compared to traditional homogeneous materials

Inventive Principle:

Principle #40Composite materials

2Productivity

If clock rate is increased to improve processing capability, then productivity is improved, but signal integrity and power integrity deteriorate due to EMI, power fluctuations, and ground bounce noise

Engineering Contradiction:

Improveprocessing capabilityVSAvoidsignal integrity and power integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The EBG structures are integrated into the power distribution network before noise propagation occurs, creating preliminary electromagnetic shielding that prevents EMI, power fluctuations, and ground bounce noise from affecting signal integrity. This preliminary anti-action allows high clock rates to be maintained without compromising reliability

Inventive Principle:

Principle #9Preliminary anti-action

Solution Approach 2:

The patent modifies the electromagnetic parameters of the power and ground planes through EBG integration, changing the propagation characteristics of electromagnetic noise. This parameter change enables high-speed operation by suppressing noise generation and propagation mechanisms that would otherwise degrade signal and power integrity at high clock rates

Inventive Principle:

Principle #35Parameter changes

3Use of energy by moving object

If operating voltage is decreased to improve power consumption, then energy efficiency is improved, but noise suppression capability deteriorates

Engineering Contradiction:

Improvepower consumptionVSAvoidnoise susceptibility

Core Design Contradiction:

Use of energy by moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent changes the electromagnetic impedance parameters of the power distribution network through EBG structure integration. These parameter changes create frequency-selective filtering that suppresses noise independently of operating voltage level, allowing low-voltage operation with improved power consumption while maintaining or enhancing noise suppression capability through the EBG's inherent electromagnetic filtering properties

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The EBG structure enhances signal and power integrity by effectively suppressing noise at high frequencies, improving device performance and reliability in SoCs and SiPs with high clock rates and low operating voltages, while allowing for frequency adjustments without area expansion.

Implementation Method 1

an electromagnetic bandgap (EBG) structure configured to suppress propagation of a frequency band of noise into power and ground planes of the EBG structure

Methodology Applied

Scientific EffectElectromagnetic bandgap: Photonic Crystal

Data Source

PatentUS9899982B2On-chip electromagnetic bandgap (EBG) structure for noise suppression

Publication Date: 2018.02.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An integrated circuit (IC) die for electromagnetic band gap (EBG) noise suppression is provided. A power mesh and a ground mesh are stacked within a back end of line (BEOL) region overlying a semiconductor substrate, and an inductor is arranged over the power and ground meshes. The inductor comprises a plurality of inductor segments stacked upon one another and connected end to end to define a length of the inductor. A capacitor underlies the power and ground meshes, and is connected in series with the inductor. Respective terminals of the capacitor and the inductor are respectively coupled to the power and ground meshes. A method for manufacturing the IC die is also provided.