On-Chip Heating Element for Semiconductor Burn-In Testing
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Solution Overview
Problem
Current semiconductor chip burn-in testing is inefficient due to the use of bulky, expensive external ovens that require external heating sources, leading to prolonged heating and cooling times and increased manufacturing costs, as well as limitations in achieving high-speed testing.
Innovation Solution
A circuit integrated into the semiconductor chip featuring a heating element, temperature sensor, reference generator, comparator, and buffer that allows for internal temperature control, enabling testing at desired temperatures without external heat sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If external ovens are used for burn-in testing, then the semiconductor chips can be tested at elevated temperatures, but the equipment becomes bulky and area inefficient
Solution Approach 1:
The heating function is extracted from the external oven and integrated directly into the semiconductor chip through an on-chip heating element. This eliminates the need for bulky external heating equipment while maintaining the capability to perform elevated temperature testing.
Solution Approach 2:
The semiconductor chip performs its own heating function through an integrated heating element, eliminating the need for external heating sources. The chip becomes self-sufficient for temperature control during burn-in testing.
2Temperature
If external ovens are used for burn-in testing, then the semiconductor chips can be tested at elevated temperatures, but the manufacturing cost increases
Solution Approach 1:
The expensive external oven equipment is replaced by a simple on-chip heating element and temperature sensor integration, significantly reducing the manufacturing cost while maintaining elevated temperature testing capability.
Solution Approach 2:
The patent uses simple, inexpensive on-chip heating elements and temperature sensors that can be easily manufactured and integrated, replacing costly external oven equipment with affordable integrated components.
3Productivity
If multiple semiconductor chips are placed on a burn-in board, then throughput increases, but the clock rate is limited resulting in difficult high speed testing
Solution Approach 1:
Each semiconductor chip independently controls its own temperature through integrated heating elements and temperature sensors, eliminating the need for synchronized temperature control of multiple chips. This independence allows each chip to operate at its optimal clock rate without being constrained by the presence of other chips on the burn-in board.
4Temperature
If external sources are used to heat the oven and burn-in board, then the semiconductor chip can be heated, but the heating time is longer than required for the chip in isolation
Solution Approach 1:
The heating function is extracted from external sources and placed directly on the chip. This direct heating approach eliminates the thermal mass of external equipment (oven and burn-in board) that would otherwise need to be heated, significantly reducing the heating time.
Solution Approach 2:
The semiconductor chip heats itself through an integrated heating element, eliminating the need to heat external equipment. This self-heating capability reduces heating time because only the chip's small thermal mass needs to be heated rather than the entire oven and burn-in board assembly.
5Temperature
If external sources are used to heat the semiconductor chip, then the chip can reach testing temperature, but the cooling time is also extended
Solution Approach 1:
The heating and cooling functions are both integrated on-chip. The same heating element can be turned off to allow rapid cooling, or a separate on-chip cooling element can be activated, eliminating the need to wait for external equipment to cool down.
Solution Approach 2:
The semiconductor chip independently controls its own cooling process through integrated cooling elements or by simply turning off the heating element. This self-cooling capability reduces cooling time because the chip can dissipate heat directly without being constrained by the thermal mass and cooling rate of external equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces testing time and manufacturing costs by allowing for efficient internal heating and temperature control, enabling faster and more precise burn-in testing of semiconductor chips.
Implementation Method 1
a first heating element built into the semiconductor chip. The first heating element generates heat to increase the temperature of the semiconductor chip
Implementation Method 2
a temperature sensor which is built into the semiconductor chip. The temperature sensor measures the temperature of the semiconductor chip to provide a voltage corresponding to the temperature
Data Source
AI summary
A circuit for controlling temperature of a semiconductor chip includes a first heating element that is built into the semiconductor chip. The first heating element generates heat to increase the temperature of the semiconductor chip. The chip also includes a temperature controller that is coupled to the first heating element and built into the semiconductor chip. The temperature controller controls the temperature to enable testing of the semiconductor chip at a desired temperature.