On-Chip Inductor Resonator for Flat Broadband RF Response
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Solution Overview
Problem
Existing circuit topologies face challenges in achieving flat frequency response and broad bandwidth while minimizing noise, current consumption, and maintaining linearity, particularly in high-frequency RF circuits used in network nodes like base stations.
Innovation Solution
An on-chip inductor design with a first and second sub-coil in series, connected by a permanent electrical connection, and a resistor in parallel to the second sub-coil, is used to optimize the Q-factor and achieve a flat frequency response and broad bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If parallel LC resonators are used to achieve high frequency operation and low current consumption, then the Q-factor is improved, but the bandwidth is limited and frequency response becomes non-flat
Solution Approach 1:
The inductor is divided into two sub-coils (first sub-coil and second sub-coil) with different Q-factors and inductance values. The first sub-coil has higher Q-factor for low-frequency operation, while the second sub-coil has lower Q-factor for high-frequency operation. This segmentation allows the circuit to maintain good frequency response across a broad bandwidth by combining the strengths of both sub-coils.
2Speed
If low ohmic broadband load is used to operate at very high frequencies, then the frequency of operation is improved, but noise increases and linearity deteriorates
Solution Approach 1:
The invention changes the impedance parameter of the load by using a broadband resonator with carefully selected component values. The resonator is designed with specific inductance values (L1, L2) and capacitance values (C1, C2) to achieve a broadband impedance response that maintains high frequency operation while avoiding the noise penalties of low-ohmic loads. The quality factor Q is optimized to balance bandwidth and noise performance.
3Adaptability or versatility
If operation amplifier based broadband circuits are used to achieve high bandwidth, then the bandwidth is improved, but current consumption increases significantly
Solution Approach 1:
The invention replaces the active op-amp based broadband circuit with a passive RLC resonator circuit. By substituting the mechanical/electronic active system (op-amp) with a passive resonant system, the circuit achieves broadband operation through resonance rather than through high-gain amplification, thereby dramatically reducing current consumption while maintaining wide bandwidth.
4Measurement precision
If tuned circuits are used to achieve high Q-factor, then the selectivity is improved, but the frequency response becomes non-flat and bandwidth is limited
Solution Approach 1:
The invention introduces asymmetry in the resonator design by using two sub-coils with different characteristics (different inductance values and Q-factors) instead of a single symmetric tuned circuit. This asymmetric configuration, combined with carefully selected capacitance values, creates a broadband resonant response that maintains selectivity while achieving a flatter frequency response across a wider bandwidth.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a flat frequency response and broad bandwidth, reducing noise and current consumption, while maintaining linearity and scalability, suitable for high-frequency RF circuits in network nodes.
Implementation Method 1
The magnetic flux generated by the first and second sub-coils is in the same direction. Since the two sub-coils are electrically connected in series, an additive mutual inductance is created, which increases the total inductance of the inductor.
Data Source
AI summary
Provided is an on-chip inductor for realizing broadband and a flat frequency response. The on-chip inductor includes an inductor coil comprising a first sub-coil and a second sub-coil having mutual inductance, wherein the first sub-coil and the second sub-coil form a permanent electrical connection in series and the second sub-coil is placed inside the first sub-coil on the chip. Furthermore, the on-chip inductor includes terminals connected to the first sub-coil and a resistor connected in parallel to the second sub-coil.


