On-Chip Infrared Absorption Layer for Thinner Imaging Modules
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Solution Overview
Problem
Existing imaging devices face challenges in reducing module thickness while maintaining imaging performance due to the need for thick infrared light absorption layers to achieve sufficient infrared light absorption, which can decrease visible light transmission and lead to non-uniform absorption.
Innovation Solution
Incorporating a low refractive index layer on an on-chip lens with an infrared absorption layer containing a cyanine dye with a specific structure, allowing for effective infrared light absorption without the need for a separate infrared cut filter, thereby reducing module thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a thick infrared light absorption layer is used to achieve sufficient infrared light absorption, then infrared light absorption capability is improved, but visible light transmission is decreased and module thickness is increased
Solution Approach 1:
The patent applies local quality by making the infrared absorption layer thickness non-uniform, with the thickness being greater at the center and smaller at the periphery. This localized variation in thickness allows the center region to provide sufficient infrared absorption while the thinner peripheral regions preserve visible light transmission, thus resolving the contradiction between infrared absorption capability and visible light transmission.
Solution Approach 2:
The patent changes the thickness parameter of the infrared absorption layer from a uniform value to a variable value that depends on the radial position. By adjusting the thickness parameter locally (greater at center, smaller at periphery), the patent achieves both sufficient infrared absorption in the center region and maintains visible light transmission in the peripheral regions.
2Object-affected harmful factors
If the infrared light absorption layer is provided on the lens to eliminate near infrared light noise, then infrared light absorption is improved, but the thickness of the infrared light absorption layer becomes non-uniform requiring it to be thickened
Solution Approach 1:
The patent applies local quality by designing the infrared absorption layer with spatially varying thickness - thicker at the center where infrared absorption is most needed and thinner at the periphery. This localized thickness variation eliminates the need to uniformly thicken the entire layer, thereby reducing overall material usage and module thickness while maintaining effective near-infrared noise elimination.
Solution Approach 2:
The patent applies partial action by providing infrared absorption primarily where it is most needed (the center region with greater thickness) rather than uniformly across the entire layer. This partial concentration of absorption capability achieves sufficient noise elimination without the excessive thickness that would result from uniform thickening.
3Measurement precision
If an absorption type infrared light cut filter is used to improve color reproducibility, then detection wavelength accuracy is improved, but module thickness is increased making downsizing difficult
Solution Approach 1:
The patent merges the infrared absorption function directly into the lens structure by forming the infrared absorption layer on the lens surface. This integration eliminates the need for a separate thick infrared light cut filter, thereby maintaining accurate detection wavelength (by effectively removing infrared light) while significantly reducing module thickness and enabling downsizing.
Solution Approach 2:
The patent applies the nesting principle by embedding the infrared absorption layer within the lens structure itself. The absorption layer is nested on the lens surface, combining the optical focusing function of the lens with the infrared filtering function in a single integrated component, thus eliminating the need for an external filter and reducing overall module thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves low infrared light transmittance and high visible light transmittance, enabling a thinner imaging device without compromising imaging performance.
Implementation Method 1
an infrared light absorption layer including a cyanine dye represented by Chemical Formula (A)... effectively removes infrared light without the need for a separate infrared cut filter
Data Source
AI summary
An imaging device, comprising: an infrared light absorption layer including a cyanine dye represented by Chemical Formula (A) below: wherein R1 and R2 are selected from the group consisting of: a chain alkyl group, a cyclic alkyl group, a phenyl group, and a benzyl group; wherein the chain alkyl group and the cyclic alkyl group including at least one group member selected from the group consisting of: 1) a first group having one or more hydrogen atoms in a first alkyl group substituted with at least one functional group selected from the group consisting of: a halogen atom, an alkoxy group, an alkanoloxy group, an amino group, a thiol group, and a mercapto group; 2) a second group having at least one reactive group selected from the group consisting of: a vinyl group, an acrylic group, a carbonyl group, a carboxyl group, an alkenyl group, an alkenyloxy group, an alkoxycarbonyl group, a nitrile group, a carboxyl group, a carbonyl group, a sulfonyl group, a sulfamoyl group, a carbamoyl group, a benzoyloxy group, and a cyano group, wherein the reactive group is any one of introduced at a terminal alkyl group of at least one of the chain alkyl group and the cyclic alkyl group and positioned two or more carbon atoms away from an indoline ring; 3) an unsubstituted chain alkyl group; and 4) an unsubstituted cyclic alkyl group; and wherein X− represents an anion.