On-Chip Power Sensor for Millimeter-Wave Transmitter Calibration
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Solution Overview
Problem
Conventional methods for calibrating millimeter-wave transmitters are complex, require expensive equipment, and cannot be recalibrated once the system is in use, making it difficult to accurately measure and adjust for variations in RF power transmission.
Innovation Solution
An on-chip power sensor integrated with a millimeter-wave transmitter on a chip, which includes a temperature-dependent resistor and a power splitter to directly measure transmit power, allowing for precise calibration and compensation of power estimators without the need for external equipment or recalibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional calibration methods are used for millimeter-wave transmitters, then measurement capability is provided, but device complexity and cost increase significantly
Solution Approach 1:
The patent combines the power measurement function with the existing transmitter chip by integrating a power sensor directly onto the chip. This merging eliminates the need for separate external calibration equipment and directional couplers, thereby reducing device complexity while maintaining measurement precision.
Solution Approach 2:
The transmitter system performs its own power measurement and calibration using the integrated power sensor, eliminating the need for external calibration equipment. The system calibrates itself by comparing the power sensor readings with the transmitter output, thereby reducing overall system complexity and cost.
2Measurement precision
If conventional calibration equipment is used, then power measurement is possible, but cost increases
Solution Approach 1:
The power sensor is integrated directly onto the transmitter chip, eliminating the need for expensive external calibration equipment. This integration reduces manufacturing costs while maintaining the ability to accurately measure transmit power.
Solution Approach 2:
Instead of using expensive external calibration equipment, the patent creates an on-chip copy of the power measurement function using a power sensor that mimics the behavior of external calibration devices, thereby reducing cost while maintaining measurement capability.
3Measurement precision
If conventional calibration methods are used, then initial calibration is possible, but recalibration capability is lost
Solution Approach 1:
The integrated power sensor enables the transmitter to perform self-calibration at any time during operation. The system can continuously monitor and adjust its calibration using the power sensor feedback, thereby gaining adaptability and recalibration capability that conventional methods lack.
Solution Approach 2:
The power sensor provides continuous feedback about the actual transmit power to the control system, enabling real-time calibration adjustments. This feedback mechanism allows the system to adapt and recalibrate as needed, improving both precision and versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and efficient measurement of RF power transmission, improving the reliability and precision of millimeter-wave transmitters by allowing for direct measurement and calibration of transmit power on the same chip, reducing the complexity and cost of calibration processes.
Implementation Method 1
the power sensor comprises a resistor formed in a layer of the chip, the resistance of the resistor varying over temperature
Implementation Method 2
a power sensor on the chip adapted to measure at least a portion of a transmit power transmitted over the at least one transmit path, wherein the power sensor comprises a resistor formed in a layer of the chip, the resistance of the resistor varying over temperature
Data Source
AI summary
An on-chip power sensor and a millimeter-wave communication device (e.g. transmitter or transceiver) on a chip including the on-chip power sensor are described. The millimeter-wave communication device can also include a coupler disposed on a transmit path, the coupler being configured to receive a transmit signal and to provide the transmit signal to an antenna connection (e.g. pad). The on-chip power sensor can be configured to receive a coupled portion of the transmit signal from the coupler, and measure a transmit power of the transmit signal based on the coupled portion of the transmit signal.