On-Chip Semiconductor Electricity Conversion Structure for Power Distribution
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Solution Overview
Problem
Conventional methods for providing power supply to integrated circuit chips require numerous off-chip power components, leading to high costs, susceptibility to interference, complex management, and significant power loss due to voltage drops in interconnecting wires, which complicates heat dissipation and increases power consumption.
Innovation Solution
A semiconductor chip with an integrated electricity conversion structure that includes semiconductor electricity-to-light and light-to-electricity conversion units, where the emitting spectrum of the former matches the absorption spectrum of the latter, allowing for efficient voltage and current conversion within the chip, reducing voltage drop and power loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple off-chip power components are used to provide various supply voltages, then the power supply requirements of different circuit modules can be met, but the chip cost increases, the chip area occupied by bonding pads increases, and the system becomes more complex and susceptible to interference
Solution Approach 1:
The patent merges multiple power supply functions into a single integrated on-chip power conversion structure. This structure includes a high-voltage power supply unit, a converter unit with coupled inductors, and multiple output units that can provide different voltage levels (e.g., first voltage for digital circuits, second voltage for analog circuits, third voltage for flash memory). By integrating these functions on-chip, the system eliminates the need for multiple off-chip power components and bonding pads, thereby reducing system complexity while maintaining the ability to provide various supply voltages to different circuit modules.
2Adaptability or versatility
If multiple off-chip power components and bonding pads are used, then various power supplies can be inputted, but the chip area is occupied and chip cost increases
Solution Approach 1:
The patent integrates multiple power conversion functions into a single on-chip structure, eliminating the need for multiple separate off-chip power components and their associated bonding pads. The converter unit with coupled inductors and multiple output units provides multi-voltage capability while occupying minimal chip area compared to the alternative of using multiple off-chip components.
Solution Approach 2:
The integrated power conversion structure serves multiple functions: it can provide different voltage levels (first voltage, second voltage, third voltage) to different circuit modules such as digital circuits, analog circuits, and flash memory. The converter unit with coupled inductors can operate in different modes (e.g., first conversion mode for digital/analog power, second conversion mode for flash memory power) to meet diverse power requirements, making the structure universal and multi-functional.
3Use of energy by moving object
If power supply voltage is low and current is high, then power consumption increases, but large voltage drop occurs on interconnecting wire resistance, resulting in power loss and heat dissipation issues
Solution Approach 1:
The patent introduces an integrated on-chip power conversion structure as an intermediary between the power supply and the circuit modules. This structure includes a converter unit with coupled inductors that can efficiently convert power at different voltage levels. By generating and distributing power at appropriate voltage levels close to the consuming circuits, the system minimizes current flow through interconnecting wires, thereby reducing voltage drop and power loss on the interconnects.
Solution Approach 2:
The patent transitions from a planar power distribution approach (relying on wire resistance) to a three-dimensional integrated approach with on-chip power conversion. The converter unit with coupled inductors and multiple output units is integrated within the chip structure, enabling vertical power distribution and reducing the length and resistance of interconnecting wires, thus minimizing power loss and heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a fully integrated on-chip power distribution network with reduced voltage drop and power loss, minimizing chip area occupation, and enhancing power supply efficiency while reducing the need for external power components.
Implementation Method 1
at least one semiconductor electricity-to-light conversion unit for converting an input electric energy into a light energy
Implementation Method 2
at least one semiconductor light-to-electricity conversion unit for converting the light energy back into an output electric energy
Data Source
AI summary
A semiconductor electricity conversion structure is provided. The semiconductor electricity conversion structure includes: a substrate; and at least one semiconductor electricity conversion structure formed on the substrate, the at least one semiconductor electricity conversion structure including: at least one semiconductor electricity-to-light conversion unit for converting an input electric energy into a light energy, and at least one semiconductor light-to-electricity conversion unit for converting the light energy back into an output electric energy, in which a number of the semiconductor electricity-to-light conversion unit is in proportion to a number of the semiconductor light-to-electricity conversion unit to realize an electricity conversion, and an emitting spectrum of the semiconductor electricity-to-light conversion unit and an absorption spectrum of the semiconductor light-to-electricity conversion unit are matched with each other.