Dual On-Chip Shielding Structure for MMIC EMI Isolation
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Solution Overview
Problem
Integrated circuit components, particularly monolithic microwave integrated circuits (MMICs), are highly sensitive to electromagnetic radiation interference from both external and internal sources, which current shielding methods fail to adequately address.
Innovation Solution
A dual shielding structure is implemented on the chip level using a first shielding element, typically an organic or ferromagnetic material, and a second shielding element, typically metal, positioned around the first to provide comprehensive electromagnetic isolation, minimizing interference while maintaining component performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional shielding methods are used, then electromagnetic interference is partially reduced, but shielding effectiveness is insufficient for highly sensitive components
Solution Approach 1:
The shielding structure is divided into multiple discrete elements (first shielding element, second shielding element, via-fence) that work together to provide comprehensive electromagnetic isolation. Each segment serves a specific function in blocking different pathways of electromagnetic interference.
Solution Approach 2:
The shielding elements are nested within each other, with the first shielding element positioned above the electrical component, the second shielding element positioned above the first, and the via-fence providing additional nested shielding layers to achieve superior electromagnetic isolation.
2Object-affected harmful factors
If shielding structures are added to block electromagnetic radiation, then interference protection is improved, but device complexity increases
Solution Approach 1:
Multiple shielding functions are merged into a single integrated structure that combines the first shielding element, second shielding element, and via-fence into one cohesive shielding system, reducing the number of separate components needed.
Solution Approach 2:
The shielding structure serves multiple functions simultaneously: blocking external electromagnetic radiation, preventing internal interference between components, and providing a compact integrated solution that eliminates the need for additional capacitive or inductive structures.
3Object-affected harmful factors
If additional capacitive or inductive structures are added, then electromagnetic shielding can be enhanced, but manufacturing complexity and cost increase
Solution Approach 1:
The shielding structure uses the substrate's existing via structures and metallization layers to create the via-fence and connect shielding elements, allowing the substrate to serve its own shielding needs without requiring additional specialized components or complex assembly processes.
Solution Approach 2:
The shielding approach changes from using traditional capacitive or inductive structures to using geometrically configured conductive elements (via-fence and shielding elements) that achieve electromagnetic shielding through their physical arrangement and material properties rather than through reactive components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual shielding structure effectively blocks electromagnetic interference, preserving the performance of sensitive components without the need for additional capacitive or inductive structures, thus enhancing the reliability and efficiency of the integrated circuit.
Implementation Method 1
a first shielding element positioned above the electrical component and the passivation layer; and a second shielding element positioned above the electrical component, the passivation layer and the first shielding element
Implementation Method 2
the first shielding element and the second shielding element are configured to block electromagnetic energy from reaching the electrical component
Implementation Method 3
the passivation layer includes a set of vias; and the vias couple the reference plane to the first shielding element
Implementation Method 4
the vias are arranged as a via-fence surrounding the electrical component
Data Source
AI summary
One example discloses an on-chip shielded device, including: a planar structure including a substrate and a passivation layer; an electrical component formed within the substrate and coupled to an input signal path and an output signal path; a first shielding element positioned above the electrical component and the passivation layer; and a second shielding element positioned above the electrical component, the passivation layer and the first shielding element.