On-Chip TDR Circuits for Nonintrusive Defect Location

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Solution Overview

Problem

Existing methods for detecting defects in electronic systems, such as incomplete solders and misconnections, are cumbersome and disrupt system operations, especially in large-scale data center applications, as they require disassembly and dedicated hardware for time-domain reflectometry testing.

Innovation Solution

The integration of time-domain reflectometry (TDR) circuits directly into electronic systems, allowing for defect detection without disrupting operations, using both non-digitizing and digitizing methods to determine defect location and characteristics by analyzing signal transitions and impedance variations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional defect detection methods are used, then defects can be identified, but the system must be disassembled and operations are disrupted

Engineering Contradiction:
Improvedefect detection capabilityVSAvoidsystem operation continuity
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent merges the TDR testing function with the existing electronic system by integrating a TDR circuit that shares the electrical line with normal system operation. The TDR circuit is combined with the electrical line infrastructure, allowing defect detection without requiring separate dedicated hardware or system disassembly.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The electrical line serves dual purposes: it functions as both a data/power transmission medium for normal system operation and as a waveguide for TDR defect detection. This multi-functionality eliminates the need for dedicated testing hardware and allows continuous operation during defect detection.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If dedicated TDR hardware is used for defect detection, then accurate defect location can be determined, but device complexity and cost increase

Engineering Contradiction:
Improvedefect location accuracyVSAvoidhardware requirements
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The TDR circuit is integrated with the existing electrical line infrastructure, merging the testing function with the system's existing components. This eliminates the need for separate dedicated TDR hardware and reduces overall device complexity while maintaining defect detection capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The electrical line is used for both normal system operation and TDR defect detection, eliminating the need for dedicated testing hardware. The same physical infrastructure serves multiple functions, reducing device complexity and cost.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If traditional probing methods are used to detect defects, then defect identification is possible, but the process is time-consuming and labor-intensive

Engineering Contradiction:
Improvedefect identification capabilityVSAvoiddefect detection speed
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent replaces manual mechanical probing with automated electrical signal analysis. Instead of physically probing and manually inspecting components, the system uses electrical signals transmitted through the existing electrical line to automatically detect and locate defects, significantly increasing detection speed.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system performs self-diagnosis by using its own electrical line infrastructure to detect defects. The TDR circuit utilizes the existing electrical line to send test signals and analyze reflections, allowing the system to identify its own defects without external intervention or manual probing.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient and non-intrusive detection of defects in complex electronic systems, reducing design and fabrication costs and allowing for real-time testing without disrupting system operations, while providing accurate location and characteristic analysis of defects.

Implementation Method 1

receiving a second signal transition arising in response to a reflection of the first signal transition from the defect

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS11221379B2Systems and methods for on-chip time-domain reflectometry
Publication Date: 2022.01.11 MEDIATEK SINGAPORE PTE LTD
  • US11221379B2 patent drawing
  • US11221379B2 patent drawing
  • US11221379B2 patent drawing

AI summary

Systems and methods for detecting the presence and/or location of defects (e.g., incomplete solders, broken cables, misconnections, defective sockets, opens, shorts, etc.) along electrical lines are described. The systems and methods described herein may use time-domain reflectometry (TDR), a measurement technique used to determine the characteristics of electrical lines by observing reflected waveforms. TDR may be performed in some embodiments by determining the times when a first event and a second event occur, and by determining the space traveled by a probe signal based on these times. The first event may occur when a first signal transition crosses a first threshold and the second event may occur when a second signal transition crosses a second threshold, where the second signal transition may arise in response to the first signal transition reflecting against a defect along the electrical line.