On-Chip Temperature Regulation Circuit for Low-Cost Calibration
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Solution Overview
Problem
Current semiconductor circuit manufacturing processes require extensive and costly temperature calibration across a wide range to ensure accuracy, particularly for battery management systems, which increases production costs and competitiveness concerns.
Innovation Solution
The implementation of programmable temperature regulation circuits on chip systems, utilizing a heating element and regulation loop with a diode and operational transconductance amplifier to control temperature within a target area, allowing for calibration and temperature adjustment during both testing and normal operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature calibration is performed at multiple temperatures during final test, then accuracy over wide temperature range is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies preliminary action by performing temperature calibration during the wafer fabrication process before final packaging and testing. This allows calibration data to be collected and stored in non-volatile memory while the chip is still on the wafer, eliminating the need for costly post-packaging temperature chamber testing. The calibration is done in advance when the chips are more accessible and less expensive to process.
Solution Approach 2:
The patent replaces the mechanical temperature chamber system with an on-chip temperature sensor and calibration circuit. Instead of physically placing packaged chips in temperature chambers for calibration, the system uses integrated temperature sensors that measure the actual chip temperature and store calibration coefficients in non-volatile memory, substituting complex external thermal testing equipment with simple on-chip sensing and digital storage.
2Measurement precision
If temperature calibration is performed at multiple temperatures, then accuracy is improved, but testing time increases
Solution Approach 1:
The patent performs temperature calibration in advance during the wafer fabrication process rather than during final packaged product testing. This preliminary calibration captures temperature characteristics while chips are still on the wafer, allowing rapid measurement of multiple temperature points without the time-consuming process of repeatedly heating and cooling individual packaged chips in temperature chambers.
Solution Approach 2:
The patent changes the temperature parameter dynamically during wafer fabrication using process integration techniques. Multiple temperature calibration points are obtained by leveraging temperature variations that occur naturally during different stages of the fabrication process, rather than requiring controlled step-wise temperature changes in final product testing, thus reducing total calibration time.
3Manufacturing precision
If on-chip temperature regulation is implemented, then temperature control accuracy is improved, but device complexity increases
Solution Approach 1:
The patent merges the temperature sensing, calibration, and compensation functions into a single integrated on-chip system. The temperature sensor, non-volatile memory for storing calibration coefficients, and digital compensation circuitry are all combined within the same chip package, eliminating the need for separate external temperature control devices and reducing overall system complexity despite the enhanced temperature control capability.
Solution Approach 2:
The patent implements self-service by enabling the chip to automatically sense its own temperature, retrieve appropriate calibration coefficients from non-volatile memory, and apply compensation to its output signals without external intervention. This self-calibrating capability improves temperature control accuracy while avoiding the complexity of external temperature regulation hardware and control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs by enabling accurate temperature regulation and improved performance across a wide temperature range, enhancing the accuracy of temperature-sensitive components without the need for extensive calibration.
Implementation Method 1
a first heating element on a chip that converts a first amount of electrical power to heat
Implementation Method 2
a first diode that provides a first temperature feedback voltage to a first operational transconductance amplifier
Data Source
AI summary
Programmable temperature regulation circuits, and methods of operating programmable temperature regulation circuits, are disclosed for providing heat to a target area on a chip. The programmable temperature regulation circuits include a heating element on the chip, and a regulation loop operatively connected to the heating element. The regulation loop includes a first diode that measures the temperature in the target area, and an operational transconductance amplifier. The operational transconductance amplifier receives a reference temperature voltage from a reference voltage, and a temperature feedback voltage from the diode, and generates an output voltage to control the provision of electrical power to the heating element.