On-Die Power Switch for Multi-Voltage Semiconductor Operation
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Solution Overview
Problem
Conventional semiconductor devices face challenges with high power source costs, complex PCB layouts, and increased area due to the need for multiple operation voltages and extra power sources to meet varying performance requirements, especially when some devices require a minimum operation voltage higher than others.
Innovation Solution
Incorporation of an on-die power switch within the semiconductor die that selectively couples power input nodes to a power output node, allowing selection of a target operation voltage from multiple power sources, reducing the need for external power sources and simplifying PCB layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If extra power sources are adopted to meet multiple operation voltage requirements, then power performance is improved, but power source cost increases
Solution Approach 1:
The power switch circuit is designed to handle multiple operation voltages (first operation voltage and second operation voltage) through a single unified circuit structure. The circuit can selectively connect to different power sources based on voltage requirements, making one power switch circuit serve multiple voltage domains instead of requiring separate circuits for each voltage level.
Solution Approach 2:
The power switch circuit acts as an intermediary between multiple power sources and the target device. It selectively connects the appropriate power source to the target device based on the required operation voltage, eliminating the need for multiple dedicated power source connections and reducing overall power source requirements.
2Reliability
If extra power sources are adopted to meet multiple operation voltage requirements, then power performance is improved, but PCB layout complexity increases
Solution Approach 1:
Multiple power source connections and voltage selection functions are merged into a single power switch circuit block on the semiconductor die. This consolidation reduces the number of separate power source connections needed on the PCB, simplifying the overall layout while maintaining the capability to supply multiple operation voltages to different devices.
3Reliability
If extra power sources are adopted to meet multiple operation voltage requirements, then power performance is improved, but PCB area increases
Solution Approach 1:
The power source selection and voltage switching functionality is extracted from the PCB level and integrated into the semiconductor die itself through the power switch circuit. This extraction eliminates the need for multiple external power sources and their associated PCB connections, thereby reducing the required PCB area while maintaining full power performance capability.
Data Source
AI summary
A semiconductor die includes an on-die power switch and a target device. The on-die power switch includes a plurality of power input nodes, a power output node, and a switch circuit. The power input nodes receive a plurality of operation voltages from a plurality of different power sources, respectively. The power output node outputs a target operation voltage selected from the operation voltages. The switch circuit selectively couples one of the power input nodes to the power output node. The target device operates according to the target operation voltage supplied from the on-die power switch. The on-die power switch and the target device are separate circuit blocks of the semiconductor die.