On-Mold Antenna for Millimeter-Wave Signal Transmission
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Solution Overview
Problem
Designing circuits for 5G and IoT applications using millimeter-wave frequencies faces challenges such as low antenna bandwidth and efficiency due to tight integration with other components, resulting in inefficiencies like 30% efficiency and 3 dBi gain for on-die antennas.
Innovation Solution
A semiconductor device architecture is developed, incorporating a semiconductor layer, polymer layer, mold, nodes, and conductive elements to form an integrated RF antenna with improved bandwidth, featuring a ground element and RF filter to enhance signal communication and reduce interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If tight integration of antenna with other components is implemented, then device integration is improved, but antenna bandwidth deteriorates
Solution Approach 1:
The patent segments the antenna system into multiple layers: on-die antenna elements integrated with the semiconductor device, and separate on-package antenna elements formed on the package substrate. This segmentation allows each antenna type to serve different functions and frequency ranges, thereby increasing overall system bandwidth while maintaining tight integration benefits.
Solution Approach 2:
The patent transitions from a two-dimensional on-die antenna configuration to a three-dimensional multi-layer structure by adding antenna elements on the package substrate above the semiconductor device. This dimensional expansion provides additional spatial freedom for antenna design, enabling broader bandwidth operation without compromising integration.
2Adaptability or versatility
If tight integration of antenna with other components is implemented, then device integration is improved, but antenna efficiency deteriorates
Solution Approach 1:
The patent divides the antenna system into on-die and on-package segments, allowing the on-package antennas to serve as high-efficiency radiating elements while the on-die elements handle signal distribution. This segmentation enables the system to achieve both integration and efficiency by placing the most efficient antenna type in the optimal location.
Solution Approach 2:
The patent introduces conductive vias and transmission lines as intermediary elements that efficiently couple the on-die antenna elements to the on-package antenna elements. These intermediaries minimize signal loss and maintain high overall antenna efficiency while enabling the integrated multi-layer structure.
3Adaptability or versatility
If on-die antenna configuration is used, then device integration is improved, but antenna gain deteriorates
Solution Approach 1:
The patent merges on-die antenna elements with on-package antenna elements into a unified multi-layer antenna system. The on-package antennas, which have larger effective aperture and higher gain characteristics, work in conjunction with the on-die elements to provide both integration benefits and enhanced gain performance.
Solution Approach 2:
The patent adds a vertical dimension to the antenna system by placing antenna elements on the package substrate above the semiconductor device. This three-dimensional configuration increases the effective radiating area and improves antenna gain without sacrificing the integration advantages of on-die elements.
Data Source
AI summary
A semiconductor device comprising an on-mold antenna for transmitting and/or receiving a millimeter-wave radio frequency signal is provided. The semiconductor device includes a semiconductor layer; a polymer layer proximal to the semiconductor layer; a mold proximal to the polymer layer; a plurality of nodes proximal to the semiconductor layer and distal to the polymer layer; an antenna disposed on the mold; and a conductive element providing electrical communication between the antenna and a first node. The mold may be from 500 μm to 1000 μm thick, such as from 750 μm to 800 μm thick, such as about 775 μm.