On-Package I/O Interface Using Magnetic Coupling

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Solution Overview

Problem

Conventional input/output interfaces require significant power and chip area for high-bandwidth interconnections, making them undesirable for applications needing smaller chip areas and reduced power consumption.

Innovation Solution

The development of an On-Package I/O (OPIO) interface that provides high bandwidth with low power, area, and latency using single-ended, high-speed CMOS interfaces with impedance-matched transmitters, forwarded clock signals, and minimal electrostatic discharge protection, allowing for close chip assembly and reduced silicon area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional I/O interfaces are used for high-bandwidth interconnections, then bandwidth is achieved, but power consumption and chip area increase significantly

Engineering Contradiction:

ImprovebandwidthVSAvoidpower consumption

Core Design Contradiction:

ProductivityVSUse of energy by moving object

Solution Approach 1:

The patent replaces conventional mechanical/electrical I/O interfaces with a magnetic field-based communication system. Magnets embedded in the package substrate generate magnetic fields that induce currents in receiver coils on chips, enabling data transmission without direct electrical contact. This substitution eliminates the need for high-power electrical I/O circuits while maintaining high bandwidth, directly resolving the contradiction between bandwidth and power consumption

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a package substrate with embedded magnets as an intermediary between transmitter and receiver chips. This intermediary enables wireless-like magnetic coupling across the package, allowing high-bandwidth communication without the power and area overhead of conventional electrical I/O interfaces. The intermediary magnetic field mechanism achieves the desired bandwidth while avoiding the energy consumption problems of direct electrical connections

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If conventional I/O interfaces are used for high-bandwidth interconnections, then bandwidth is achieved, but chip area increases significantly

Engineering Contradiction:

ImprovebandwidthVSAvoidchip area

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

The patent replaces area-intensive electrical I/O circuits with compact magnetic field generation and detection components. The transmitter uses small embedded magnets in the substrate rather than large electrical interface circuits, and the receiver uses compact coil structures. This substitution dramatically reduces the chip area required for high-bandwidth interconnections while maintaining the same bandwidth capability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent moves the interaction from a planar electrical contact dimension to a three-dimensional magnetic field dimension. By embedding magnets in the package substrate and using magnetic coupling through space rather than direct electrical contact, the system achieves high bandwidth without requiring large planar chip areas for I/O interfaces. This dimensional shift enables compact chip designs with high interconnection bandwidth

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Area of stationary object

If chips are assembled closer together in a package, then area is reduced, but signal integrity and interference become more challenging

Engineering Contradiction:

Improvepackage areaVSAvoidsignal interference

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the electrical connection function and replaces it with magnetic field coupling. By removing the need for direct electrical contact and associated signal routing, the system eliminates electrical interference, crosstalk, and signal integrity issues that typically worsen with closer chip spacing. The magnetic field mechanism is inherently immune to these electrical interference problems, allowing chips to be assembled closer together without compromising signal quality

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent creates an electrically inert environment by using magnetic field coupling instead of electrical connections. The magnetic interaction occurs through the package substrate without direct electrical contact, effectively isolating signals from electrical interference, ground loops, and crosstalk. This inert magnetic coupling environment enables close chip spacing while maintaining excellent signal integrity, as magnetic fields are not susceptible to the same interference mechanisms as electrical signals

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Data Source

PatentUS9535865B2Interconnection of multiple chips in a package

Publication Date: 2017.01.03 INTEL CORP

AI summary

An interface. A first set of single-ended transmitter circuits reside on a first die having a master device. A first set of single-ended receiver circuits reside on a second die. The receiver circuits have no termination and no equalization. The second die has a slave device responsive to the master device of the first die. Conductive lines connect the first set of transmitter circuits and the first set of receiver circuits. The lengths of the conductive lines are matched.