On-Package Stiffener Antenna for 5G Wireless and Warpage Control
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Solution Overview
Problem
Microelectronics packages face structural warpage and require additional components for wireless communication, as traditional antennas increase manufacturing costs and complexity.
Innovation Solution
Incorporating a picture frame stiffening element as an on-package integrated stiffener antenna (oPiS antenna) made of conductive material, which is tuned to function as a wireless antenna, eliminating the need for a separate antenna and providing structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a separate antenna is added for wireless communication, then wireless communication capability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the antenna function with the package substrate by integrating conductive traces directly into the substrate structure. This merging eliminates the need for a separate antenna component, thereby maintaining wireless communication capability while reducing device complexity and manufacturing cost.
Solution Approach 2:
The package substrate is designed to serve multiple functions: it provides mechanical support for the electronic component and simultaneously functions as an antenna for wireless communication. The conductive traces on the substrate enable wireless capability without requiring additional dedicated antenna structures, achieving multi-functionality.
2Stability of the object's composition
If a metallic sheet is added for structural support, then structural stability is improved, but manufacturing cost increases
Solution Approach 1:
The package substrate performs dual functions: it provides structural support to prevent warpage and simultaneously serves as an antenna for wireless communication. By making the substrate itself multi-functional, the patent eliminates the need for separate metallic reinforcement sheets, thereby maintaining structural stability while reducing manufacturing cost.
Solution Approach 2:
The structural support function is merged into the package substrate itself rather than being provided by a separate metallic sheet. The substrate's own structure and materials are optimized to provide both mechanical support and antenna functionality, eliminating the need for additional structural reinforcement components.
3Adaptability or versatility
If multiple separate components are used for different functions, then functional performance is improved, but ease of manufacture deteriorates
Solution Approach 1:
The patent merges multiple functions (structural support and wireless communication) into a single integrated package substrate structure. The conductive traces are formed as part of the substrate manufacturing process rather than being added as separate components, significantly simplifying manufacturing while maintaining full functional performance.
Solution Approach 2:
The package substrate is designed as a multi-functional component that simultaneously provides structural support, electrical connectivity, and antenna functionality. This multi-functionality eliminates the need for multiple separate components, thereby improving ease of manufacture while maintaining comprehensive functional performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The oPiS antenna enhances wireless communication capabilities while preventing structural warpage, reducing manufacturing costs and simplifying the package design by utilizing the stiffening element's resonant frequency and gain for wireless applications like 5G and wireless charging.
Implementation Method 1
the stiffening element may be configured to act as an antenna and a traditional antenna may be excluded from the package
Data Source
Figure 1~2A
Figure 2B~2C
Figure 3A~3B
AI summary
Described herein are microelectronics packages and methods for manufacturing the same. The microelectronics package may include a transmitter, a receiver, and a package stiffening element. The package stiffening element may be in electrical communication with the transmitter and the receiver. The package stiffening element may be configured to act as an antenna for both the transmitter and the receiver.