On-Package Transformer Power Delivery for High-Current Semiconductor Dies
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Solution Overview
Problem
Large semiconductor devices such as processors and ASICs require high current at low voltages, posing challenges for packaging technologies in terms of power, thermal, and signal management.
Innovation Solution
A method and apparatus for supplying power to semiconductor chips using a driver circuit outside the semiconductor package to drive a transformer, with output circuits inside the package including a power transformer and rectification circuit to provide DC power, and a power bus to carry AC power from the driver to the output circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If on-silicon switching regulators are used in semiconductor devices, then power conversion is integrated into the chip, but silicon real estate is occupied and power conversion efficiency is reduced
Solution Approach 1:
The patent extracts the power conversion function from the semiconductor chip by using a separate magnetic component that couples to the chip through electromagnetic induction. This allows the chip to receive power without containing switching regulators, thereby preserving silicon real estate while maintaining efficient power conversion in an external dedicated component.
2Power
If high current at low voltage is supplied to large semiconductor devices, then power demands are met, but thermal management and packaging challenges increase
Solution Approach 1:
The patent introduces a magnetic component as an intermediary that transfers power wirelessly through electromagnetic coupling. This mediator enables high current delivery to the semiconductor device without direct electrical connections that would generate heat at connection points, thereby simplifying thermal management while meeting power demands.
3Use of energy by moving object
If power converters are placed close to semiconductor chips, then power delivery efficiency is improved, but space requirements and power dissipation increase
Solution Approach 1:
The patent moves the power conversion function from the planar chip surface to a three-dimensional magnetic component that couples through electromagnetic fields. This dimensional transition allows power conversion to occur in space adjacent to but not occupying chip area, thereby reducing footprint while maintaining efficient power delivery through close electromagnetic coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution efficiently supplies high current at low voltages to semiconductor chips, improving power and thermal management while reducing the space and power dissipation requirements for power converters.
Implementation Method 1
a power transformer including a first winding and a second winding, an input connected to the first winding for receiving AC power from the driver output
Implementation Method 2
a rectification circuit connected to the second winding for rectifying power received from the transformer
Data Source
AI summary
A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die. Multi-output POL circuits may be used in conjunction with on-chip rail-selection and regulation circuitry to further improve efficiency. A three-stage power conversion system includes off-package, on-package and on-chip conversion stages.