On-the-fly alignment for semiconductor singulation
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Solution Overview
Problem
Existing singulation systems for electronic components, such as semiconductor substrates, face prolonged cycle times and increased costs due to the need for separate vision stations for pattern recognition alignment, which also risk contamination and require additional motion axes.
Innovation Solution
Implementing a method with dual cameras mounted on spindle axes that capture images of alignment marks on-the-fly as the substrate moves, allowing for continuous motion and reducing the need for additional motion axes and vision stations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a separate vision station is used for pattern recognition alignment, then alignment accuracy is improved, but cycle time increases and system complexity increases
Solution Approach 1:
The patent combines the pattern recognition alignment function with the existing spindle axis by mounting a camera on the spindle. This merging eliminates the need for a separate vision station, allowing alignment to occur during the normal positioning movement without adding extra time or complexity to the system.
Solution Approach 2:
The alignment process is integrated into the continuous motion of the spindle positioning system. The camera captures alignment marks during the normal positioning movement, eliminating idle time for alignment operations and maintaining continuous productive action throughout the process.
2Measurement precision
If a separate vision station is used for pattern recognition alignment, then alignment accuracy is improved, but device complexity increases
Solution Approach 1:
The patent merges the vision alignment system with the existing spindle axis structure by mounting the camera directly on the spindle. This integration eliminates the need for additional motion axes, chuck tables, and related mechanisms that would be required for a separate vision station, thereby reducing system complexity while maintaining alignment accuracy.
3Measurement precision
If a separate vision station is used for pattern recognition alignment, then alignment accuracy is improved, but cost increases
Solution Approach 1:
The patent combines the alignment function with the existing spindle system, eliminating the need to purchase and install a separate vision station with additional motion axes and chuck tables. This integration reduces capital equipment costs while maintaining the required alignment accuracy through the mounted camera system.
4Measurement precision
If a separate vision station is used for pattern recognition alignment, then alignment accuracy is improved, but contamination risk increases
Solution Approach 1:
The patent extracts the vision alignment function from the sawing zone environment by mounting the camera on the spindle axis rather than using a separate station in the contamination-prone area. This positioning allows the camera to capture alignment marks without being exposed to water and debris from the dicing process, preventing contamination while maintaining alignment accuracy.
Data Source
AI summary
A method for determining virtual cutting lines for a substrate prior to its singulation is provided whereby the substrate comprises first and second rows of alignment marks which are substantially parallel to each other such that a pair of alignment marks each from the first and second rows of alignment marks is configured for determining a position of a virtual cutting line. The method comprises the steps of positioning the first row of alignment marks along a relative motion path of a first camera and positioning the second row of alignment marks along a relative motion path of a second camera. While the substrate is being moved relative to the first and second cameras along the respective relative motion paths without stopping, the first and second cameras capture images of multiple pairs of alignment marks from the first and second rows of alignment marks during such motion. Thereafter, the position of each virtual cutting line is determined from the images of each pair of alignment marks along the first and second rows of alignment marks relating to the virtual cutting line and stored in a storage device for use during singulation.