On-Wafer Dynamic Testing System for High-Current Power Devices
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Solution Overview
Problem
Conventional on-wafer testing systems are inadequate for high-current and high-voltage dynamic testing of electronic devices, as they suffer from significant voltage drops due to inductance issues, limiting the accuracy and magnitude of electric currents that can be provided, and are unable to characterize the switching performance of devices like power control devices effectively.
Innovation Solution
A test system comprising a probe head assembly, probe-side and chuck-side contacting structures, and a chuck with an electrically conductive support surface, allowing for selective electrical contact and communication between the probe and the device under test, which reduces inductance and capacitance by canceling electric fields through the use of non-magnetic transmission lines and compliant conductive members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional test systems are used to provide large electric currents for dynamic testing, then the testing can be performed, but significant voltage drops occur due to inductance, limiting testing accuracy and current magnitude
Solution Approach 1:
The patent introduces an intermediate structure positioned between the probe head assembly and the device under test. This intermediate structure serves as a mediator to reduce the inductance of the test system, thereby minimizing voltage drops during dynamic testing and improving both current delivery capability and measurement accuracy
Solution Approach 2:
The patent changes the physical parameters of the test system by using non-magnetic materials for transmission lines and adjusting the geometric configuration of contacting structures. These parameter changes reduce inductance and capacitance, enabling accurate dynamic testing at high frequencies and fast rise times
2Adaptability or versatility
If conventional test systems are used for dynamic testing, then some testing can be performed, but the systems are unable to characterize switching performance of power control devices
Solution Approach 1:
The patent employs dynamic testing capabilities with fast rise times and high-frequency square wave signals to characterize the switching performance of power control devices. The system can dynamically adjust test parameters to accurately measure switching characteristics that conventional static or slow-testing systems cannot capture
Solution Approach 2:
The patent uses periodic square wave signals with adjustable frequencies and duty cycles to test the switching performance of electronic devices. This periodic action allows for comprehensive characterization of switching behavior under various operating conditions, enabling reliable testing of high-current power control devices
3Measurement precision
If inductance is reduced to improve testing accuracy, then voltage drops decrease, but the test system becomes more complex with additional contacting structures
Solution Approach 1:
The patent segments the test system into distinct functional components: a probe head assembly for electrical contact with the device, an intermediate structure to reduce inductance, and a chuck with contacting structures for additional electrical connections. This segmentation allows each component to be optimized independently while working together to reduce overall system inductance and improve measurement accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and high-precision dynamic testing of electronic devices by providing large electric currents and characterizing switching performance, reducing inductance and capacitance, and allowing for higher frequency measurements and faster rise times.
Implementation Method 1
reduces inductance and capacitance by canceling electric fields through the use of non-magnetic transmission lines and compliant conductive members
Data Source
AI summary
Systems and methods for on-wafer dynamic testing of electronic devices. The systems include a probe head assembly, a probe-side contacting structure, a chuck, and a chuck-side contacting structure. The probe head assembly includes a probe configured to electrically contact a first side of a device under test (DUT). The probe-side contacting structure includes a probe-side contacting region. The chuck includes an electrically conductive support surface configured to support a substrate that includes the DUT and to electrically contact a second side of the DUT. The probe head assembly and the chuck are configured to translate relative to one another to selectively establish electrical contact between the probe and the DUT. The chuck-side contacting structure includes a chuck-side contacting region that is in electrical communication with the electrically conductive support surface and opposed to the probe-side contacting structure. The methods may include methods of operating the system or systems.