On-board Radiation Sensing via Beam Splitting
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Solution Overview
Problem
Existing technologies for on-board electromagnetic radiation detection, particularly for infrared (IR) radiation, face challenges in efficiently sensing and measuring radiation distributions using conventional methods.
Innovation Solution
The implementation of a radiation sensing apparatus that utilizes beam splitting, incorporating a micro-mirror chip, an image sensor, and a beamsplitter unit with a partially-reflective surface, allows for efficient detection and measurement of electromagnetic radiation distributions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional electromagnetic radiation detection methods are used, then the detection capability is limited, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The radiation detection device is segmented into multiple independent micromechanical radiation sensing pixels arranged in an array. Each pixel operates independently to detect radiation, allowing the system to achieve comprehensive detection capability while maintaining modular simplicity that reduces overall device complexity
Solution Approach 2:
The micromechanical radiation sensing pixels serve multiple functions: they detect electromagnetic radiation, convert it to mechanical displacement, and generate optical signals that can be captured by imaging sensors. This multi-functionality eliminates the need for separate detection components, reducing device complexity while enhancing detection precision
2Productivity
If conventional radiation sensing methods are used, then the sensing efficiency is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The micromechanical radiation sensing pixels automatically convert absorbed radiation into mechanical displacement and optical signals without requiring external intervention or complex processing. This self-service mechanism enhances sensing efficiency while using standard micromechanical fabrication techniques that do not demand excessive manufacturing precision
Solution Approach 2:
The device utilizes changes in physical parameters (radiation absorption leading to thermal expansion or piezoelectric effect causing mechanical displacement) to enhance sensing efficiency. These parameter changes occur naturally in the micromechanical pixels, achieving high productivity without requiring extreme manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables accurate and efficient on-board sensing of electromagnetic radiation, including IR radiation, for applications such as human detection, fire detection, gas detection, temperature measurements, and environmental monitoring.
Implementation Method 1
The implementation of a radiation sensing apparatus that utilizes beam splitting, incorporating a micro-mirror chip, an image sensor, and a beamsplitter unit with a partially-reflective surface
Implementation Method 2
The apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces
Implementation Method 3
The enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter
Data Source
AI summary
Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. The light source can be attached to a printed circuit board. Optionally, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter.