Production Line Control for On-Demand PCB Printing and Mounting
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Solution Overview
Problem
Existing manufacturing methods for electronic devices with embedded electronic components face challenges in on-demand production due to the need for photomasks or printing plates, which restrict flexibility in changing wiring patterns and require complex switching of work conditions and programs for each product type, especially during high-temperature soldering processes.
Innovation Solution
A control device that integrates a mounter, resin shaping machine, and printing machine, with a specification setting unit, program selectors, and counters to manage the placement, shaping, and printing of electronic components and wiring patterns, allowing for flexible on-demand production without the need for pre-made masks or plates, and enabling easy customization of electronic device specifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photomask or printing plate making is used to manufacture printed circuit board, then wiring pattern can be formed with high precision, but it is necessary to previously prepare photomask or printing plate making which restricts flexibility in changing wiring pattern and makes switching work complicated
Solution Approach 1:
The patent uses inkjet printing to directly form wiring patterns on the circuit board without requiring physical photomasks or printing plates. The digital design data is copied directly onto the board through inkjet deposition, eliminating the need for intermediate mask/plate preparation and enabling flexible pattern changes by simply updating the digital data.
Solution Approach 2:
The patent replaces the mechanical photomask/printing plate system with a digital inkjet printing system. Instead of using physical masks that require fabrication and replacement, the system uses digital data control to direct inkjet nozzles, substituting mechanical mask handling with digital control and direct material deposition.
2Reliability
If high-temperature heat treatment associated with soldering is performed during electronic component mounting, then electronic components can be securely mounted, but material selection for the printed circuit board is restricted
Solution Approach 1:
The patent performs wiring pattern formation through inkjet printing before the resin shaping and component mounting processes. By completing the wiring formation in advance using heat-curable conductive ink that is cured during the resin shaping process, the system eliminates the need for subsequent high-temperature soldering, thereby preserving material selection flexibility while ensuring component mounting reliability through the embedded component approach.
Solution Approach 2:
The patent changes the curing method from high-temperature soldering to lower-temperature UV or visible light curing of photopolymer-based conductive ink. This parameter change in the curing process allows the use of a broader range of resin materials that would be damaged by high-temperature soldering, while still achieving reliable electrical connections.
3Adaptability or versatility
If work conditions and programs of post-processes are switched for each product type, then production can be adapted to different products, but switching work becomes complicated
Solution Approach 1:
The patent employs a universal inkjet printing system that can form various wiring patterns for different product types using the same equipment and process flow. By using digital design data to control the inkjet printing, the system achieves multi-functionality without requiring physical reconfiguration, thereby reducing switching work complexity while maintaining production adaptability.
Solution Approach 2:
The patent implements dynamic switching of wiring patterns through digital data input to the inkjet printing system. Instead of static physical masks that require manual replacement, the system dynamically changes the wiring pattern by loading different digital design data, enabling quick adaptation to different product types without complicated physical switching operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient on-demand production of electronic devices with embedded components, allowing for quick adaptation to changing demands and preventing illegal actions by ensuring precise positioning of components and wiring, thus enhancing production flexibility and security.
Implementation Method 1
a printing machine configured to form a wiring on a surface of the shaped resin body by ejecting conductive ink according to a designated pattern
Data Source
Figure 1A~1B
Figure 2
Figure 3(a)~3(d)
AI summary
When a specification setting unit (12) sets a specification of a lot number "k+1" after setting a specification of a lot number "k", a mounting program selector (14) performs a mounting program corresponding to the lot number "k", and then selects a mounting program corresponding to the lot number "k+1" according to matching between a mounting number from the mounting program and a planned number of products of the lot number "k". A printing program selector (20) selects a printing program corresponding to the lot number "k", and then selects a printing program corresponding to the lot number "k+1" according to matching between a sum of a printing number from the printing program and a defective product number and the planned number of products of the lot number "k". Consequently, on-demand production of an electronic device can easily be manufactured on a manufacturing line.