On-Die Memory Heater Switching for Accurate Thermal Emulation
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Solution Overview
Problem
Conventional methods for testing power and thermal operating conditions of microelectronic systems are inefficient, as they require building specific heater packages for each system, which is time-consuming and costly, and do not accurately model the system's specific conditions, including the presence of other components and airflow patterns.
Innovation Solution
Incorporating a heater device with a resistive element and switching circuitry into microelectronic devices, such as memory devices, that can emulate operational power consumption and heat generation, allowing for the simulation of anticipated power and thermal conditions without a complete system or memory controller, using resistive elements to draw anticipated current and generate heat, and adjusting operating parameters based on emulated conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional heater packages are built for each system, then power and thermal conditions can be tested, but the process is time-consuming and costly
Solution Approach 1:
The patent integrates a heater device directly into the microelectronic device itself, making the device capable of serving both its primary function and thermal testing function. This eliminates the need for separate heater packages for different systems, as the integrated heater can be universally applied across various microelectronic devices to emulate power consumption and heat generation under different operating conditions.
Solution Approach 2:
The heater device is pre-integrated into the microelectronic device during manufacturing, allowing thermal and power condition testing to be performed immediately without requiring subsequent assembly of separate heater packages. This preliminary integration eliminates time-consuming setup procedures and enables rapid testing under anticipated operating conditions.
2Measurement precision
If conventional heater packages are built for each system, then thermal conditions can be simulated, but the system-specific conditions including airflow patterns are not accurately modeled
Solution Approach 1:
The heater device is positioned in specific locations on the microelectronic device where heat generation occurs, allowing localized thermal conditions to be accurately emulated. The heater can be placed adjacent to memory arrays or other heat-generating components to replicate the actual thermal profile and airflow patterns that would occur in the complete system, providing system-specific condition modeling without requiring the entire system assembly.
3Measurement precision
If complete systems are assembled for testing, then accurate operating conditions can be measured, but the process is time-consuming and costly
Solution Approach 1:
The patent extracts the thermal testing function from the complete system assembly and integrates it directly into the microelectronic device. This allows the heater device to independently emulate power consumption and heat generation without requiring the complete system to be assembled, thereby improving productivity by enabling testing at the device level rather than requiring full system integration.
Solution Approach 2:
The microelectronic device performs its own thermal and power condition testing through the integrated heater device, eliminating the need for external testing equipment and complete system assembly. The device can self-emulate its operating conditions and be tested in isolation, significantly improving testing efficiency and reducing costs while maintaining measurement accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and efficient emulation and measurement of power and thermal conditions within microelectronic systems, allowing for fine-tuning of system parameters like fan speeds and heat sinks without a complete system, and can be used as a 'plug and play' component to test power and thermal conditions on-site.
Implementation Method 1
resistive elements to draw anticipated current and generate heat
Data Source
AI summary
A memory device includes at least one die and a heater device. The heater device includes a first switch element electrically connected to a power supply connection and the at least one die, a second switch element electrically connected to the first switch element, and a resistive element electrically connected to the second switch element and a ground connection. A method includes configuring the first switching element of the heater device to electrically connect the second switching element of the heater device to a power supply connection, configuring the second switching element to electrically connect one of a first resistor or a second resistor of the resistive element to the first switching element, and applying a voltage across the first resistor or the second resistor that is electrically connected to the first switching element.