On-Die Hotspot Temperature Sensing for Fast Thermal Control

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Solution Overview

Problem

Current temperature measurement methods for processor cores are inaccurate due to the placement of thermal diodes away from hotspots, leading to discrepancies in temperature readings and inefficient cooling, and external sensors suffer from time delays and accuracy issues.

Innovation Solution

Integrating a temperature sensor directly at the hotspot on the die for real-time temperature measurement and reporting, using a single sensor for both measurement and trigger functions, allowing for optimized processor operation and improved thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a thermal diode is placed away from the hotspot due to routing limitations, then the device complexity is reduced, but the measurement precision deteriorates with temperature differences as high as 15°C

Engineering Contradiction:
Improverouting complexityVSAvoidtemperature reading accuracy
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The patent introduces temperature compensation circuitry that acts as an intermediary to correct the temperature measurements. The circuit uses a compensation diode and associated circuitry to calculate and apply corrections to the hotspot temperature reading, thereby eliminating the measurement error caused by physical separation without requiring complex routing changes

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the electrical parameters (voltage, current) of the compensation diode based on the measured temperature differential. By adjusting these parameters dynamically, the system compensates for the spatial separation between the thermal diode and hotspot, maintaining measurement precision without increasing routing complexity

Inventive Principle:
Principle #35Parameter changes

2Measurement precision

If a separate sensor is used to detect maximum threshold temperature at the hottest hotspot, then the measurement precision is improved, but the device complexity increases and time delay occurs due to physical separation

Engineering Contradiction:
Improvehotspot temperature detection accuracyVSAvoidsensor system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent makes the existing thermal diode perform multiple functions: it serves as both the primary temperature sensor for continuous monitoring and as the trigger point for thermal protection. The compensation circuitry enables this single sensor system to accurately detect hotspot temperatures without requiring a separate dedicated sensor, thereby reducing device complexity while maintaining precision

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines the temperature sensing function and thermal protection trigger function into a single integrated system using the same thermal diode. By merging these functions and using compensation rather than adding a separate sensor, the system achieves accurate hotspot detection without increasing device complexity or introducing time delays

Inventive Principle:
Principle #5Merging (Combining)

3Measurement precision

If an external sensor is used for temperature detection, then the measurement range is extended, but the speed of temperature reporting deteriorates due to physical separation from the hotspot

Engineering Contradiction:
Improvetemperature measurement capabilityVSAvoidtemperature reporting speed
Core Design Contradiction:
Measurement precisionVSSpeed

Solution Approach 1:

The compensation circuitry acts as an intermediary that processes signals locally on-die, eliminating the need for external sensors. This keeps the measurement system integrated and close to the hotspot, maintaining fast response times while achieving accurate temperature measurement through computational compensation rather than physical proximity

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the speed, consistency, and accuracy of temperature reporting, enabling better thermal control and performance optimization in thermally constrained environments by allowing for immediate and precise adjustments to processor operation.

Implementation Method 1

integrate a temperature sensor directly at a hotspot of the die for measurement and reporting of temperature values

Methodology Applied
Scientific EffectTemperature-dependent forward voltage drop: Diode

Data Source

PatentUS7878016B2Device and method for on-die temperature measurement
Publication Date: 2011.02.01 INTEL CORP
  • US7878016B2 patent drawing
  • US7878016B2 patent drawing
  • US7878016B2 patent drawing

AI summary

A system for measuring and managing thermal operations of a processor core on a semiconductor die using a sensor positioned in a hotspot of the processor core. A measured temperature reading is determined based upon a temperature sensed by the sensor. Interrupt signals and a software readable register indicating temperature information provide feedback about the thermal environment to the processor. Based upon the measured temperature reading, the interrupt signals direct the processor to modify operation.