On-Die Passive Components for Compact Semiconductor Packaging
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Solution Overview
Problem
Semiconductor packages face constraints in miniaturization due to limited space for passive electronic components, which restricts design options and routing efficiency, often requiring these components to be placed outside the package, increasing the overall footprint.
Innovation Solution
Integrating passive electronic components such as resistors, inductors, and capacitors directly on semiconductor dies within the package, allowing for a reduced footprint and increased component density, while freeing up substrate space for improved routing and signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If passive electronic components are placed on the substrate, then routing efficiency is constrained, but placing them outside the package increases the overall footprint
Solution Approach 1:
The patent merges the substrate and passive electronic components into a single integrated structure. The passive components (resistors, capacitors, inductors) are formed directly on the substrate using the same semiconductor manufacturing processes, eliminating the need for separate component placement and interconnection. This integration resolves the contradiction by improving routing efficiency through direct connections while maintaining a compact footprint within the substrate area.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement where passive components are placed on the substrate surface to a three-dimensional integrated structure where passive components are formed within the substrate layers. By utilizing vertical stacking and multi-layer construction, the design accommodates both active and passive components in the same footprint area, resolving the contradiction between routing efficiency and overall footprint.
2Adaptability or versatility
If passive electronic components are placed outside the package, then design options are restricted, but integrating them on the substrate reduces available space
Solution Approach 1:
The substrate is designed to serve multiple functions simultaneously: it acts as the mechanical support structure, the electrical interconnection network, and the platform for both active and passive electronic components. By making the substrate universal and multi-functional, the patent expands design options without requiring additional space, as the same substrate area performs multiple roles.
Solution Approach 2:
The patent changes the physical and electrical parameters of the substrate by forming passive electronic components directly within its structure. The substrate material properties and layer configurations are modified to accommodate resistors, capacitors, and inductors, transforming it from a simple support structure into an active circuit platform. This parameter change enables greater design flexibility while maintaining compact dimensions.
Data Source
AI summary
Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor package includes a substrate, a semiconductor die disposed on the substrate, and a passive electronic component disposed on the semiconductor die.