On-Die Protocol Translation for Die-to-Die Bandwidth

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Solution Overview

Problem

Existing communication protocols face inefficiencies when transferring information between integrated circuits on different dies, particularly due to differences in channel formats and increased overhead, leading to reduced bandwidth and increased latency.

Innovation Solution

The implementation of a protocol translation scheme that packs information from on-die (OD) protocols into transaction units suitable for die-to-die (D2D) systems, allowing for efficient transfer of control and data information using shared or separate hardware modules.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If existing communication protocols are used for transferring information between integrated circuits on different dies, then information transfer is achieved, but overhead increases and bandwidth decreases

Engineering Contradiction:

ImprovebandwidthVSAvoidoverhead

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent changes the format parameters of transaction units by packing multiple on-die protocol transactions into fewer die-to-die transaction units. This parameter transformation reduces the number of transactions required, thereby reducing overhead and increasing effective bandwidth between dies.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent merges multiple on-die protocol transactions (control and data information from multiple channels) into consolidated die-to-die transaction units. This combining approach reduces the total number of transactions and improves bandwidth utilization across the die-to-die interface.

Inventive Principle:

Principle #5Merging (Combining)

2Loss of time

If existing communication protocols are used for transferring information between integrated circuits on different dies, then information transfer is achieved, but latency increases

Engineering Contradiction:

ImprovelatencyVSAvoidchannel format differences

Core Design Contradiction:

Loss of timeVSDevice complexity

Solution Approach 1:

The patent introduces a protocol translation layer that acts as an intermediary between on-die protocols and die-to-die communication protocols. This mediator translates and packs transactions, eliminating the need for complex channel format conversions and reducing latency.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent transforms the time-related parameters by consolidating multiple transactions into fewer packed transaction units. This parameter change reduces the total transaction time and latency between dies while managing channel format differences through the packing mechanism.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If protocol translation packs information into optimized transaction units, then overhead reduces and bandwidth increases, but device complexity increases

Engineering Contradiction:

Improvebandwidth utilizationVSAvoidprotocol translation scheme

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent implements a universal protocol translation scheme that can handle multiple on-die protocol types and channel formats through a single packing mechanism. This multi-functional approach manages the added complexity by providing a standardized translation layer that works across different protocol variations.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Use of energy by moving object

If transaction units are optimized for die-to-die transfer, then power consumption decreases, but manufacturing complexity increases

Engineering Contradiction:

Improvepower consumptionVSAvoidmanufacturing complexity

Core Design Contradiction:

Use of energy by moving objectVSEase of manufacture

Solution Approach 1:

The patent optimizes power consumption by changing the transaction unit parameters to reduce the total number of transactions required for data transfer. This parameter optimization reduces energy usage while the standardized packing approach keeps manufacturing complexity manageable.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20250165415A1Systems, methods, and apparatus for using on-die protocol with die-to-die system

Publication Date: 2025.05.22 SAMSUNG ELECTRONICS CO LTD

AI summary

An apparatus may include a die including at least one circuit configured to receive, using a first channel of an on-die interface, first information, receive, using a second channel of the on-die interface, second information, generate one or more transaction units including the first information and the second information, and send, using at least one die-to-die system, the one or more transaction units. An apparatus may include a die including at least one circuit configured to receive, using at least one on-die interface, first information for a first transaction, receive, using the at least one on-die interface, second information for a second transaction, generate one or more transaction units including the first information and the second information, and send, using at least one die-to-die system, the one or more transaction units.