On-Die Analog Sensor Feedback for IC Thermal Control
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Solution Overview
Problem
Existing IC testing methods struggle to maintain accurate temperature control during testing, leading to inadequate simulation of field conditions or potential damage due to temperature deviations, particularly in large ICs with significant temperature gradients.
Innovation Solution
Implementing internal analog sensors integrated with individual compute units of the IC to provide precise temperature measurements, using a feedback control system to adjust heat supply or removal based on these measurements, ensuring temperature is maintained within a desired range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external temperature sensors are used to monitor IC temperature, then the testing setup is simpler, but the temperature control accuracy deteriorates due to inability to detect internal temperature gradients
Solution Approach 1:
The patent divides the IC into multiple temperature monitoring zones by integrating separate temperature sensors with individual compute units. Each sensor independently monitors temperature in its specific region, enabling detection of temperature gradients across the IC die. This segmentation approach transforms a single-point measurement system into a distributed measurement network, resolving the contradiction between measurement accuracy and system complexity.
Solution Approach 2:
The patent embeds temperature sensors directly within the compute units of the IC, nesting the sensing elements inside the processing structure. This nested configuration allows temperature monitoring at the source of heat generation without requiring external attachment, thereby improving measurement accuracy while minimizing additional complexity through integrated design.
2Speed
If temperature monitoring is performed with delay, then the control system is simpler, but the response to power transients deteriorates leading to temperature deviations
Solution Approach 1:
The patent implements continuous real-time temperature monitoring by the ATC system, performing temperature measurements and control actions without delay. The system continuously compares actual temperature against target temperature and immediately adjusts power delivery when deviations are detected, enabling rapid response to power transients before temperature excursions occur.
Solution Approach 2:
The patent establishes a closed-loop feedback control system where temperature sensors continuously provide temperature data to the ATC system, which then adjusts power delivery based on the difference between actual and target temperatures. This feedback mechanism enables automatic, real-time compensation for temperature deviations caused by power transients, resolving the contradiction between response speed and control complexity.
3Adaptability or versatility
If uniform temperature is maintained across the IC, then the control is simpler, but the testing adequacy deteriorates due to inability to simulate field conditions with temperature gradients
Solution Approach 1:
The patent applies different temperature conditions to different regions of the IC by maintaining uniform power delivery while allowing natural temperature gradients to develop during testing. The distributed temperature sensors monitor local temperatures in various compute units, enabling the system to accommodate and measure temperature variations rather than enforcing uniformity. This local quality approach allows the IC to experience realistic thermal conditions similar to field operation.
Solution Approach 2:
The patent implements dynamic temperature control where the ATC system continuously adjusts power delivery based on real-time temperature measurements from multiple sensors. Rather than maintaining a static uniform temperature, the system dynamically responds to changing thermal conditions, allowing temperature gradients to naturally develop and evolve during testing while keeping peak temperatures within safe limits through active control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables superior temperature control and faster response to power transients, minimizing damage and ensuring comprehensive testing by accurately accounting for temperature gradients across different parts of the IC.
Implementation Method 1
obtain temperature measurements from a plurality of analog temperature sensors integrated with individual compute units of the IC
Implementation Method 2
supplying heat to increase a temperature of the IC when the temperature of the IC falls below a desired temperature range
Implementation Method 3
removing heat to decrease a temperature of the IC when the temperature of the IC exceeds the desired temperature range
Data Source
AI summary
Methods and systems are provided for active thermal control (ATC) of an integrated circuit (IC) during a testing procedure. The methods and systems described herein involve obtaining a plurality of measurements of a die of the IC. The plurality of temperature measurements are provided by a plurality of temperature sensors integrated with the die. Each individual sensor can, for example, be integrated with an individual compute unit of a graphics processing unit (GPU) or with an individual core of a central processing unit (CPU). The methods and systems described herein further involve controlling, based on the plurality of temperature measurements, a temperature forcing system to implement ATC. Control of the temperature forcing system involves supplying heat to the IC when a temperature falls below a desired test temperature range and/or removing heat from the IC when a temperature exceeds the desired test temperature range.