On-Die Leadless Temperature Sensing for Compact Chip Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic components face challenges in achieving compact packaging due to the space requirements of surface mount technology (SMT) discrete components, and internal temperature sensors suffer from inaccuracies and delays in measuring heat distribution within the component.
Innovation Solution
Implementing leadless discrete components, such as leadless temperature sensors, directly on the semiconductor die or sandwiched between the substrate and leads, allows for accurate and timely temperature measurement while reducing package size by eliminating the need for additional substrate area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If surface mount technology (SMT) discrete components are used for temperature sensing, then the component can be integrated into the electronic device, but the package size increases due to additional substrate area requirements
Solution Approach 1:
The temperature sensor is integrated directly into the semiconductor die structure, merging the sensing function with the existing die substrate. This eliminates the need for separate SMT discrete components and their associated mounting area, thereby reducing overall package size while maintaining temperature sensing capability.
Solution Approach 2:
The temperature sensor is positioned within the vertical structure of the semiconductor die rather than being mounted on the substrate surface. By utilizing the third dimension (vertical integration within the die), the solution eliminates the horizontal footprint required by conventional SMT components.
2Measurement precision
If conventional temperature sensors are placed on the substrate, then the component can measure temperature, but there are inaccuracies and delays in measuring heat distribution within the component
Solution Approach 1:
The temperature sensor is extracted from the substrate level and repositioned directly within the semiconductor die structure. This extraction from the conventional mounting position allows the sensor to be placed closer to the heat-generating elements, enabling more accurate and timely measurement of internal temperature distribution.
Solution Approach 2:
The semiconductor die itself serves as an intermediary medium between the heat-generating components and the temperature sensor. By embedding the sensor within the die structure, the die material facilitates direct thermal coupling, improving measurement accuracy and reducing thermal delays compared to substrate-mounted sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in more compact and efficient packaging with improved temperature sensing accuracy and reduced thermal delays, optimizing chip performance and extending component lifespan.
Implementation Method 1
a leadless temperature sensor having a first surface and a second surface opposite the first surface, the leadless temperature sensor being configured to measure a temperature of the semiconductor die
Data Source
AI summary
Apparatuses disclosed herein are configured to support temperature sensing, including on-die temperature sensing, within an electronic component. An illustrative apparatus may include a substrate, a semiconductor die disposed on the substrate, a leadless temperature sensor, and a plurality of leads including at least a first lead and a second lead. The semiconductor die may implement a transistor and the leadless temperature sensor may be configured to measure a temperature of the transistor, in some cases by being disposed directly on the semiconductor die. The first lead may be electrically coupled with a first surface of the leadless temperature sensor while the second lead may be electrically coupled with a second surface of the leadless temperature sensor. Corresponding methods for fabricating such apparatuses are also disclosed.