One-Component Thermosetting Resin Composition for Low-Temperature Curing

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Solution Overview

Problem

Conventional one-component thermosetting resin compositions fail to achieve adequate adhesive strength and storage stability when cured at low temperatures, limiting their effectiveness and efficiency in applications requiring low-temperature curing.

Innovation Solution

A one-component thermosetting resin composition comprising an epoxy resin, core-shell polymer particles, dicyandiamide, amine adduct curing agent, and optionally a urea compound or epoxy-based reactive diluent, with specific ratios and amounts, ensuring an exothermic onset temperature above 80°C and peak temperature below 150°C, enhancing adhesive strength and storage stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If conventional thermosetting resin compositions are used for low-temperature curing, then energy consumption is reduced, but adhesive strength and storage stability deteriorate

Engineering Contradiction:
Improveenergy consumptionVSAvoidadhesive strength and storage stability
Core Design Contradiction:
Use of energy by moving objectVSReliability

Solution Approach 1:

The patent modifies the chemical composition parameters of the thermosetting resin system by introducing polymer particles with specific core-shell structures and controlling the ratios of curing agents (dicyandiamide and amine adduct) to achieve low-temperature curing while maintaining adhesive strength and storage stability. The exothermic peak temperature is controlled to 150°C or lower through parameter optimization.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite thermosetting resin composition by combining epoxy resin with polymer particles having core-shell structures, dicyandiamide, and amine adduct curing agents. This composite formulation enables synergistic effects that achieve both low-temperature curing and high adhesive strength, resolving the contradiction between energy savings and performance.

Inventive Principle:
Principle #40Composite materials

2Ease of operation

If one-component type thermosetting resin compositions are formulated, then ease of operation is improved, but adhesion properties and storage stability worsen

Engineering Contradiction:
Improveease of operationVSAvoidadhesion properties and storage stability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent merges multiple functional components (epoxy resin, polymer particles with core-shell structures, dicyandiamide, and amine adduct curing agents) into a single integrated composition formulation. This merging achieves one-component type simplicity while the internal structure of the composition maintains adhesion properties and storage stability through the coordinated interaction of its constituents.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The polymer particles with core-shell structures act as intermediary elements that mediate between the epoxy resin and curing agents, enabling controlled low-temperature curing while maintaining storage stability. The shell layer of the polymer particles serves as an intermediary that regulates the curing reaction and preserves composition stability during storage.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition enables the production of cured products with excellent adhesive strength and stability at low temperatures, reducing energy consumption and carbon emissions, contributing to sustainable development goals by lowering production costs and greenhouse gas emissions.

Implementation Method 1

the one-component type thermosetting resin composition has an exothermic onset temperature of not lower than 80° C. and an exothermic peak temperature of not higher than 150° C. in a DSC curve

Methodology Applied
Scientific EffectExothermic reaction: Exothermic Reaction

Data Source

PatentUS20250289952A1One-component thermosetting resin composition and utilization thereof
Publication Date: 2025.09.18 KANEKA CORP

AI summary

A one-component type thermosetting resin composition that makes it possible to provide a cured product having excellent adhesive strength by low-temperature curing and that has excellent storage stability is provided. The one-component type thermosetting resin composition contains an epoxy resin, polymer particles, dicyandiamide, and an amine adduct curing agent each in specific amounts. The one-component type thermosetting resin composition has a specific exothermic onset temperature and a specific exothermic peak temperature. In addition, the one-component type thermosetting resin composition has a specific amount of urea compound, has a specific amount of epoxy-based reactive diluent, or has a specific amount of epoxy group in a shell layer of the polymer particles.