One-Piece Encapsulation for Mechatronic Assembly Protection

Solution Overview

Problem

Current mechatronic assemblies for motor vehicle control units, such as transmission control units, face challenges in protecting electronic components from external influences like metallic chips and aggressive media, leading to increased production costs due to the need for multiple housings and complex sealing mechanisms.

Innovation Solution

A mechatronic assembly with a one-piece encapsulation that surrounds all components on the carrier circuit board in a form-fitting and material-locking manner, using a hardenable encapsulation material like thermosetting plastic with inorganic fillers, which also serves as a stiffening rib to ensure mechanical stability and reduce the need for a base plate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple housings and sealing mechanisms are used to protect electronic components from external influences, then protection reliability is improved, but device complexity and manufacturing cost increase

Engineering Contradiction:

Improveprotection reliabilityVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple separate housing components and sealing mechanisms into a single integrated encapsulation body. This one-piece encapsulation surrounds the electronic components, mechanical inserts, and connecting elements simultaneously, eliminating the need for multiple separate housings and complex sealing arrangements while maintaining comprehensive protection against external influences.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation serves multiple functions simultaneously: it protects electronic components from external influences, provides mechanical stabilization, enables heat dissipation, and seals all spaces between components. This multi-functional design replaces what would traditionally require multiple specialized components, reducing overall device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If multiple housings and sealing mechanisms are used to protect electronic components, then protection reliability is improved, but manufacturing cost increases

Engineering Contradiction:

Improveprotection reliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple separate housing components and sealing mechanisms into a single integrated encapsulation body. This one-piece encapsulation surrounds the electronic components, mechanical inserts, and connecting elements simultaneously, eliminating the need for multiple separate housings and complex sealing arrangements while maintaining comprehensive protection against external influences.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If separate housings are used for each electronic component, then individual protection is improved, but installation space increases

Engineering Contradiction:

Improveindividual protectionVSAvoidinstallation space

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent combines multiple separate housing components and sealing mechanisms into a single integrated encapsulation body. This one-piece encapsulation surrounds the electronic components, mechanical inserts, and connecting elements simultaneously, eliminating the need for multiple separate housings and complex sealing arrangements while maintaining comprehensive protection against external influences.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation design allows mechanical inserts and electronic components to be nested within the same protective enclosure. The mechanical inserts extend through the encapsulation while electronic components are positioned within the encapsulated space, creating a compact nested arrangement that minimizes overall installation space while providing continuous protection.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides enhanced protection for electronic components, improved sealing, reduced installation space, and cost optimization by eliminating the need for multiple housings and base plates, while maintaining mechanical stability under high stress conditions.

Implementation Method 1

a one-piece encapsulation (12) which surrounds all components arranged on the populated flat side in a form-fitting and material-locking manner

Methodology Applied

Scientific EffectCuring (hardening):

Implementation Method 2

using a hardenable encapsulation material like thermosetting plastic with inorganic fillers

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3257339B1Mechatronic component and method for the production thereof

Publication Date: 2019.09.25 VITESCO TECH GERMANY GMBH

Figure 1~2
Figure 3~4
Figure 5

AI summary

The invention relates to a mechatronic assembly (E), comprising a supporting circuit board (1) with at least one populated flat side on which the following components are arranged: – a multiplicity of electronic components, and – at least one mechanical insert part (4.1, 8) for the mechanical fixing of at least one electronic component. According to the invention, an encapsulation (12) of unipartite form is provided which, in form-fitting and cohesive fashion, surrounds all of the components arranged on the populated flat side of the supporting circuit board (1). The invention also relates to a method for producing a mechatronic assembly (E).