One-Piece Shielded Luminescent Diode for Radiation Protection
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Solution Overview
Problem
Optoelectronic components face challenges in being protected against environmental influences such as extraneous light radiation and rainwater, and require simple mounting solutions.
Innovation Solution
The optoelectronic component incorporates a luminescence diode chip with a shielding mechanism, where the shielding is formed in one piece with other components, such as a connection carrier or reflector wall, to laterally surround the diode chip and reduce external radiation interference, enhancing mechanical stability and ease of assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a separate shield is attached to the optoelectronic component, then the shielding against extraneous radiation is achieved, but the assembly complexity and mechanical stability are reduced
Solution Approach 1:
The shield is merged with the connection carrier to form an integral one-piece structure. This eliminates the need for separate attachment of the shield to the optoelectronic component, thereby reducing assembly complexity while maintaining effective shielding against extraneous radiation.
2Object-affected harmful factors
If a separate shield is attached to the optoelectronic component, then the shielding against extraneous radiation is achieved, but the mechanical stability is reduced
Solution Approach 1:
The shield is merged with the connection carrier to form an integral one-piece structure. This eliminates potential separation interfaces between the shield and the optoelectronic component, thereby enhancing mechanical stability while maintaining effective shielding against extraneous radiation.
3Object-affected harmful factors
If the shield completely laterally surrounds the LED chip, then the shielding against extraneous radiation is maximized, but the mounting flexibility is reduced
Solution Approach 1:
The shield is designed to laterally surround the LED chip only at selected points rather than completely. This localized shielding approach provides sufficient protection against extraneous radiation from critical directions while maintaining mounting flexibility and adaptability to various installation environments.
4Object-affected harmful factors
If multiple separate components are used for shielding, then the shielding effectiveness is improved, but the manufacturing complexity increases
Solution Approach 1:
The shield is merged with the connection carrier to form an integral one-piece structure. This eliminates the need for separate manufacturing and assembly of multiple shielding components, thereby reducing manufacturing complexity while maintaining effective shielding against extraneous radiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively shields the luminescence diode chip from extraneous radiation and environmental influences, improving the component's operational reliability and adaptability to various mounting locations while maintaining mechanical stability.
Implementation Method 1
the luminescence diode chip is suitable for generating electromagnetic radiation
Implementation Method 2
the shielding is suitable for keeping the extraneous radiation away from the luminescence diode chip and/or other components of the optoelectronic component
Data Source
Figure 1A~1B
Figure 1C
Figure 2A~2B
AI summary
The invention relates to an optoelectronic component (10), comprising – at least one luminescent diode chip (1) which emits electromagnetic radiation (2) during the operation of the optoelectronic component, - at least one shield (3) against external radiation (4) which laterally surrounds the luminescent diode chip (1) in some regions only, wherein – each shield (3) is designed as one piece with a component (20, 30, 40, 50) of the optoelectronic component (10).