One-piece Semiconductor Particle Detector with Dual-sided Detection
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Solution Overview
Problem
Existing particle detection devices using semiconductor materials face challenges in achieving double redundant detection while maintaining transparency, size, and cost efficiency, particularly in medical applications where precise control of high-energy beams is critical.
Innovation Solution
A one-piece particle detection device is designed with two independent detectors formed on either side of a common substrate, using semiconductor material with different doping levels and conductive layers to create Schottky or PIN diodes, ensuring electrical insulation and allowing for double detection without increasing the device's thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two independent detectors are used for double redundant detection, then safety and measurement precision are improved, but device complexity and size increase
Solution Approach 1:
The patent combines two independent detectors into a single integrated device by forming both detectors on opposite faces of the same semiconductor substrate. The substrate serves as a common support structure, and the detectors share the same manufacturing process and electrical connection system, thereby achieving double redundant detection while reducing device complexity and size compared to using two separate detectors.
2Measurement precision
If semiconductor material thickness is increased to improve detection capability, then measurement precision is improved, but transparency and energy loss worsen
Solution Approach 1:
The patent transitions from a single-sided detection architecture to a dual-sided detection architecture by forming detectors on both faces of the semiconductor substrate. This dimensional change allows the particle beam to be detected from both directions, effectively doubling the detection capability without increasing the thickness of the semiconductor material in the beam path, thereby maintaining transparency while improving measurement precision.
3Loss of energy
If semiconductor material thickness is reduced to improve transparency, then transparency is improved, but detection capability and measurement precision worsen
Solution Approach 1:
By forming detectors on both faces of the semiconductor substrate, the patent effectively doubles the detection surface area without increasing the thickness of the material. This allows the beam to interact with detection structures on both sides, maintaining high transparency (thin material) while achieving sufficient detection capability through the dual-sided configuration.
4Ease of manufacture
If a common substrate is used for both detectors, then manufacturing cost and device complexity are reduced, but electrical insulation and detector independence become more difficult to achieve
Solution Approach 1:
The patent segments the semiconductor substrate into two distinct detection regions, with each face containing an independent detector with its own charge collection electrodes and signal processing circuits. The substrate is divided into first and second detection zones that are electrically isolated from each other, allowing independent operation of each detector while sharing the common substrate support structure.
Solution Approach 2:
The patent introduces intermediary electrical isolation structures, such as insulating layers or depleted regions, between the two detectors formed on opposite faces of the substrate. These intermediary elements prevent electrical interference between the detectors while allowing both to be fabricated on the same substrate, thus maintaining detector independence despite the common substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the device's transparency, reduces bulk and cost, and improves safety by enabling precise control of high-energy beams, while maintaining the longevity of the detection components.
Implementation Method 1
any type of particle capable of producing charge carriers in an electronic space charge zone formed in a semiconductor material, these charge carriers then being recovered by collectors of a detector
Data Source
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AI summary
The invention relates to a one-piece device (100) for detecting particles with semiconductor material and comprises a substrate layer (102) and at least one additional layer disposed on a first face (104) of the substrate layer (102) so as to form at least one first detector comprising a first space charge region (110) crossed by a beam of particles and first means (106, 108) for collecting charge carriers produced by this crossing. The device further comprises at least one other additional layer disposed on a second face (112) of the same substrate layer (102), opposite the first face (104), so as to form at least a second detector comprising a second space charge region (118) likewise crossed by the beam of particles and second means (114, 116) for collecting charge carriers produced by this crossing.