Optical Phased Array Scanner With Vertical IC Stacking for Fast LiDAR
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Solution Overview
Problem
Existing MEMS LiDAR technologies face issues with large size, reliability due to resonating mirrors, and long wiring response times in their optical scanners, compromising their performance and reliability.
Innovation Solution
The optical scanner is redesigned with an integrated circuit (IC) and optical phased array (OPA) stacked vertically, using flip-chip bonding to reduce size and shorten response times, replacing the MEMS chip with OPA to improve reliability and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If MEMS chip with lever structure is used for laser scanning, then laser beam scanning function is achieved, but the internal wires resonate and risk fracture reducing reliability
Solution Approach 1:
The patent removes the lever structure from the optical scanner design. By eliminating the mechanical lever that causes wire resonance, the harmful vibration and fracture risk are extracted from the system, thereby improving reliability without compromising the scanning function.
Solution Approach 2:
The patent replaces the mechanical lever-based scanning system with an electromagnetic driving system. This substitution eliminates the mechanical vibrations and wire resonance issues while maintaining the laser beam scanning capability through electromagnetic actuation of the mirror array.
2Loss of time
If MEMS chip and ASIC chip are arranged on substrate with gap and connected by wires, then electrical connection and control is achieved, but wiring length and response time become excessively long
Solution Approach 1:
The patent integrates the control circuitry directly with the mirror array structure, merging previously separate components (MEMS chip and ASIC chip) into a unified integrated device. This consolidation eliminates long wiring paths and reduces electrical signal transmission distance, thereby decreasing response time.
Solution Approach 2:
The patent transitions from a planar arrangement with gaps between chips to a three-dimensional integrated structure where control elements are embedded within or adjacent to the mirror array. This dimensional reorganization shortens the electrical connection paths significantly.
3Volume of moving object
If MEMS chip structure is used for optical scanning, then laser deflection to multiple angles is achieved, but the device size becomes too large
Solution Approach 1:
The patent divides the optical scanning function into multiple independent mirror elements arranged in an array, rather than using a single large MEMS mirror. This segmentation allows each small mirror element to be controlled independently, achieving comprehensive scanning coverage while maintaining a compact overall device size.
Solution Approach 2:
The patent creates a multi-functional integrated device where the same structure serves multiple purposes: the mirror array performs both optical reflection and mechanical actuation, while integrated electrodes provide both structural support and electrical control. This multi-functionality reduces the need for separate components, thereby miniaturizing the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The redesign results in a compact, reliable, and fast optical scanner with improved electrical signal transmission, enabling flexible and accurate non-mechanical directional scanning, enhancing the performance of LiDAR systems.
Implementation Method 1
The OPA 30 is used for non-mechanically deflecting the second laser L3 to multiple angles of emission
Data Source
AI summary
Embodiments of the present disclosure relates to an optical scanner, a laser detection system and a vehicle. The optical scanner includes a substrate, an integrated circuit (IC), an optical phased array (OPA), a wave plate and a beam splitter. The IC is mounted on the substrate. The OPA is flip - chip soldered on a surface of the IC away from the substrate and is electrically connected with the IC. The wave plate is affixed on a side of the OPA away from the IC. The beam splitter is affixed on a side of the wave plate away from the OPA. Projections of the IC, the OPA, the wave plate and the beam splitter on the substrate all have overlapping potions.