Opaque Lens Barrel for Miniaturized Light-Emitting Image Sensing Module
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Solution Overview
Problem
Conventional light-emitting image sensing modules are challenging to miniaturize for use in smaller endoscopes due to integration issues with CMOS Image Sensors (CIS) and LEDs, leading to higher costs and lower yield, with existing methods failing to efficiently control optical specifications and module size.
Innovation Solution
A light-emitting image sensing module design featuring a circuit board with an image sensor, conductive carrier, light source, opaque lens barrel, and lens module, where the opaque lens barrel sleeves both the image sensor and light source to prevent stray light and reduce module size, combined with a method involving a motherboard with cutting holes and hollow cylinders for assembly, allowing for flexible optical specifications and mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If CIS module is integrated with LED, then light-emitting function is achieved, but module volume increases
Solution Approach 1:
The patent places the LED light source inside the hollow interior space of the lens barrel, nesting the light-emitting component within the existing optical structure. This eliminates the need for separate housing spaces for both the CIS module and LED, thereby achieving light-emitting functionality without increasing overall module volume.
Solution Approach 2:
The lens barrel is designed to serve multiple functions: it houses the optical lens, provides structural support, and simultaneously contains the LED light source within its hollow space. This multi-functionality reduces the need for additional components and housing structures, keeping the module compact.
2Ease of operation
If FPC is bent to position LED, then LED can be positioned, but FPC circuits may be damaged
Solution Approach 1:
The patent extracts the LED light source from the FPC assembly and positions it independently within the hollow space of the lens barrel. The LED is electrically connected to the FPC through connection holes without requiring the FPC to be bent, thereby maintaining FPC circuit integrity while achieving proper LED positioning.
3Adaptability or versatility
If lens optical specification is varied, then endoscope requirements are met, but manufacturing cost increases
Solution Approach 1:
The patent segments the lens system into a modular lens barrel assembly that can be independently designed and manufactured with different optical specifications. This modular approach allows standardization of the lens barrel production process while accommodating various optical requirements, thereby controlling manufacturing costs despite specification variations.
4Ease of manufacture
If modularized method is used to fix FPC and barrel, then assembly is simplified, but module size increases
Solution Approach 1:
The patent merges the FPC assembly and lens barrel into a single integrated structure where the FPC is positioned and fixed within the lens barrel housing. The LED is mounted on the FPC and positioned inside the lens barrel, combining multiple components into one compact assembly that simplifies manufacturing while minimizing module size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a smaller form factor suitable for smaller endoscopes, increases yield, and provides economical scale benefits while allowing for varied optical specifications, enhancing fabrication flexibility and reducing costs through mass-produced opaque lens barrels.
Implementation Method 1
an opaque lens barrel, wherein a first hole and at least one second hole penetrate the opaque lens barrel, the positions of which are respectively corresponding to the positions of the image sensor and the conductive carrier
Implementation Method 2
The lens module is fixed in the first hole and disposed above the image sensor
Data Source
AI summary
The invention provides a light-emitting image sensing module and a method for fabricating the same. The light-emitting image sensing module includes a circuit board, an image sensor, conductive carriers, light sources, an opaque lens barrel, and a lens module. The image sensor and the conductive carriers are arranged on the circuit board. The light sources are arranged on the conductive carrier. The opaque lens barrel is penetrated by a first hole and a second hole and arranged on the circuit board. The first hole sleeves the image sensor, and the second hole sleeves the conductive carriers and the light sources. The lens module is fixed in the first hole and arranged above the image sensor. The invention uses the circuit board to carry out the packaging process of the image sensor and the light source, so as to achieve the economic benefit.