Opaque Encapsulated Sensor Layout for Low-Crosstalk Thin Modules
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Solution Overview
Problem
Existing sensor devices for mobile devices face challenges in minimizing thickness and reducing optical crosstalk, which affects measurement accuracy and requires additional space or materials for suppression.
Innovation Solution
A sensor device design featuring a carrier substrate with a light-emitting element and sensor element arranged at a distance, enclosed by a substantially opaque encapsulation material, and a structured layer to minimize crosstalk, while maintaining a compact and thin form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If emitter and detector chips are used with thickness greater than or equal to 0.6 mm, then structural stability is improved, but device thickness increases
Solution Approach 1:
The patent uses thin-film technology to create emitter and detector chips with thickness less than 0.6 mm, replacing traditional thick chips. This is achieved through advanced semiconductor fabrication processes that deposit functional layers in thin configurations, maintaining structural integrity while reducing thickness to enable ultra-thin sensor devices.
Solution Approach 2:
The patent changes the thickness parameter of the emitter and detector chips from traditional ≥0.6 mm to <0.6 mm. This parameter change is achieved through modified manufacturing processes that produce thinner semiconductor structures, directly addressing the need for reduced device thickness while maintaining operational functionality.
2Measurement precision
If discrete partitions or openings are provided between emitter and detector to suppress optical crosstalk, then measurement accuracy is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts and eliminates the need for discrete partitions or openings between emitter and detector. Instead of adding complex structural elements to block light paths, the invention uses alternative approaches such as precise spatial arrangement, optical filtering, or signal processing methods to suppress crosstalk, thereby reducing device complexity while maintaining measurement accuracy.
Solution Approach 2:
The patent replaces mechanical light-blocking structures (partitions and openings) with non-mechanical solutions. This may involve using optical filters, wavelength-specific detection, or computational methods to distinguish direct light from scattered light, thereby eliminating the need for complex mechanical partitioning structures.
3Object-affected harmful factors
If a white reflective frame is arranged around the emitter to reflect light to the side, then optical crosstalk is reduced, but light transmission through the frame reduces efficiency
Solution Approach 1:
The patent replaces the white reflective frame with alternative materials or structures that are more efficient. This may involve using black absorptive materials, metallic reflective surfaces with higher reflectivity, or integrating light-guiding structures that direct light more effectively, thereby improving emitter efficiency while still suppressing optical crosstalk.
Solution Approach 2:
The patent may use composite material structures combining different optical properties. For example, combining reflective and absorptive materials in specific patterns, or using multi-layer structures that simultaneously reflect unwanted light paths while transmitting useful light, thereby achieving both crosstalk suppression and high efficiency.
4Area of stationary object
If emitter and detector are arranged close together for compact design, then device area is reduced, but optical crosstalk increases
Solution Approach 1:
The patent applies local quality differentiation by creating distinct optical zones around the emitter and detector. This may involve local optical filters, wavelength-specific routing, or spatially differentiated light paths that allow close proximity arrangement while preventing direct light from reaching the detector. Each local region is optimized for its specific function, enabling compact design without crosstalk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces crosstalk and maintains a compact form, enhancing measurement accuracy without the need for additional space or costly materials.
Implementation Method 1
a substantially opaque encapsulation material encloses the at least one light-emitting element and the sensor element in lateral direction
Data Source
AI summary
A sensor device includes a carrier having a via for guiding an electrical contact from a bottom surface to a top surface of the carrier. The device also includes an integrated circuit on the carrier, a sensor element, an optoelectronic component on the top surface of the carrier, and a first electrically conductive contact element on the via an electrically connected thereto. The device further includes a substantially opaque encapsulation material enclosing the sensor element, the optoelectronic component, and the first electrically conductive contact element such that a surface of the sensor element and of the optoelectronic component opposite the carrier is uncovered by the encapsulation material. The device additionally includes a first conductor track on the encapsulation material electrically connecting the first electrically conductive contact element and the integrated circuit, and a second conductor track on the encapsulation material electrically connecting the integrated circuit with the optoelectronic component.