Opaque Substrate Bonding Alignment Using Holder Reference Marks
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Solution Overview
Problem
Conventional substrate alignment methods face challenges in achieving high accuracy when aligning opaque substrates without transparent or transmissive features, as existing methods rely on visibility of alignment marks through light transmission, which results in low accuracy due to distortion and limited resolution.
Innovation Solution
A substrate alignment apparatus using holders to accommodate non-adhesive surfaces of substrates, with alignment marks on adhesive surfaces and additional marks on holders, allowing camera units to capture images and an analyzer to correct alignment errors in x, y, and z axes, enabling precise alignment without relying on light transmission through substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If light transmission method is used to align opaque substrates, then alignment can be performed, but alignment accuracy deteriorates due to low resolution and distortion
Solution Approach 1:
The patent introduces a transparent substrate as an intermediary carrier that holds the opaque substrate. Alignment marks are formed on this transparent substrate, allowing optical methods to accurately detect positions while the opaque substrate being aligned remains unaffected. This mediator enables high-precision alignment without requiring the opaque substrate itself to be transparent.
Solution Approach 2:
The patent creates a copy of the alignment information by forming alignment marks on the transparent substrate that correspond to the opaque substrate's position. Instead of directly observing marks on the opaque substrate (which causes distortion), the system uses the clear marks on the transparent substrate as a distortion-free reference for alignment.
2Measurement precision
If alignment marks are formed on contact surfaces of opaque substrates, then alignment can be attempted, but viewing accuracy deteriorates making precise alignment difficult
Solution Approach 1:
The transparent substrate serves as an intermediary that carries alignment marks in a location and form that is easily viewable. The marks are formed on the transparent substrate's surface rather than on the contact surface of the opaque substrate, allowing clear optical observation while maintaining proper alignment capability.
3Strength
If adhesive bonding method is used for substrate bonding, then bonding can be achieved, but wiring alignment deteriorates because precise alignment is not required
Solution Approach 1:
The patent performs alignment marks formation and position detection before the actual substrate bonding process. By establishing the precise positions of alignment marks on the transparent substrate in advance, the system enables subsequent wiring alignment to be performed with high precision, ensuring that bonding and wiring alignment requirements are both satisfied.
Data Source
AI summary
The present invention relates to a substrate aligning device for bonding a first substrate (100) and a second substrate (200), wherein the first substrate (100) and the second substrate (200) have respective bonding surfaces via which the first substrate (100) and the second substrate (200) are bonded face-to-face with each other, and respective non-bonding surfaces which are located on the reverse sides from the bonding surfaces. The substrate alignment device comprises: a first substrate (100) having a first bonding surface (110) and a first non-bonding surface (120) located on the reverse side from the first bonding surface (110); a second substrate (200) having a second bonding surface (210) and a second non-bonding surface (220) located on the reverse side from the second bonding surface (210); a first holder (300) formed such that the first non-bonding surface (120) of the first substrate (100) is seated thereon; and a second holder (400) formed such that the second non-bonding surface (220) of the second substrate (200) is seated thereon. The first substrate (100) and the second substrate (200) are aligned by bringing the first holder (300) and the second holder (400) toward each other so that the first bonding-surface (110) and the second bonding-surface (210) come into close contact with each other. Since the alignment can be achieved without penetrating an opaque substrate, existing fine alignment limitations can be eliminated, and misalignment can be prevented.