OPC Modeling With Joint Optical–Resist Parameter Search

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Solution Overview

Problem

Conventional step-wise optimization strategies for OPC modeling fail to simultaneously determine optimum values for optical and resist model parameters, leading to suboptimal balance and optimization of photolithography model parameters.

Innovation Solution

An OPC modeling method that simultaneously adjusts optical and resist model parameters through stochastic combination generation, photolithography simulations, Pareto principle evaluation, and genetic algorithms to find optimal parameter combinations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a step-wise optimization strategy is used to determine optical model parameters first and then resist model parameters, then the optical model parameters can be optimized, but the resist model parameters cannot achieve true optimum values because the success of the second step depends on the first step

Engineering Contradiction:
Improveoptimization accuracy of photolithography model parametersVSAvoidcomplexity of parameter optimization process
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent combines the optimization of optical model parameters and resist model parameters into a single simultaneous optimization process. Instead of performing step-wise optimization where optical parameters are optimized first and then resist parameters, the patent uses a genetic algorithm that evaluates and optimizes both sets of parameters together based on photolithography simulation results, allowing them to influence each other's optimization and achieve true joint optimum values.

Inventive Principle:
Principle #5Merging (Combining)

2Ease of manufacture

If step-wise optimization is performed where optical model parameters are determined first and resist model parameters are determined second, then the process is simpler to implement, but the best balance between optical and resist model parameters cannot be achieved

Engineering Contradiction:
Improveease of implementing parameter optimizationVSAvoidbalance between optical and resist model parameters
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent implements a feedback mechanism where photolithography simulation results are used to evaluate the combined performance of optical and resist model parameters. The simulation outcomes feed back into the genetic algorithm, which adjusts both sets of parameters in subsequent iterations. This closed-loop feedback ensures that the optimization process achieves the best balance between optical and resist parameters by continuously evaluating their combined effect on critical dimension accuracy.

Inventive Principle:
Principle #23Feedback

3Power

If separate simulation of optical and resist model parameters is performed in sequence, then computational complexity is reduced, but the optimum values for both parameter sets cannot be determined simultaneously

Engineering Contradiction:
Improvecomputational efficiencyVSAvoidsimultaneous optimization accuracy
Core Design Contradiction:
PowerVSMeasurement precision

Solution Approach 1:

The patent changes the optimization approach from sequential parameter adjustment to simultaneous parameter optimization using a genetic algorithm. The algorithm maintains populations of both optical and resist parameters and evolves them together through selection, crossover, and mutation operations. This allows the system to explore the joint parameter space and determine optimum values for both parameter sets simultaneously, rather than sequentially, thereby achieving higher optimization accuracy.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS12461450B2OPC modeling method
Publication Date: 2025.11.04 HEFECHIP CORP LTD
  • US12461450B2 patent drawing

AI summary

An OPC modeling method is disclosed, which includes: step S1: determining optical model parameters and resist model parameters; step S2: obtaining a plurality of parameter combinations by stochastically choosing values for the parameters; step S3: performing photolithography simulations and etching wafers and calculating RMS values of differences between simulated CDs and etching CDs and BCE values of the CDs; step S4: evaluating the values according to Pareto principle and calculating Pareto optimum to N-th-best Pareto suboptimum sets to prioritize the plurality of parameter combinations in a descending order; step S5: applying a genetic algorithm with position-based crossover and/or mutation to the plurality of parameter combinations, to obtain new parameter combinations; and step S6: iterating steps S3 to S5 on the new parameter combinations until a number of iterations reaches a first predetermined value and using highest prioritized ones of parameter combinations resulting from a last iteration for OPC modeling.