OPD-Matched Interferometry for Thick TSV OCD Metrology

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing optical critical dimension (OCD) metrology methods struggle to accurately measure thick structures with multiple reflective surfaces due to spectral smearing and loss of sensitivity, particularly in through-silicon via (TSV) manufacturing, leading to increased complexity and cost in achieving high spectral resolution.

Innovation Solution

Employing optical path difference (OPD) matched interferometry by setting the interferometer mirror to match the optical path difference with each reflective surface, allowing for coherent interference measurements by fitting and removing partially coherent terms to extract fully coherent fields.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If high spectral resolution measurement is used to resolve spectral features for thick structures, then measurement precision is improved, but device complexity and cost increase

Engineering Contradiction:
Improvespectral resolutionVSAvoidmeasurement apparatus complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent divides the measurement process into multiple discrete wavelength measurements taken at different positions along the optical path. Instead of requiring a single high-resolution spectrometer, the system segments the spectral measurement into multiple lower-resolution measurements taken at different locations, which are then combined to achieve the equivalent of high spectral resolution.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces an intermediary scanning mechanism that moves the measurement point along the optical path. This scanning element acts as a mediator between the light source and detector, enabling the system to achieve high spectral resolution through spatial scanning rather than requiring a complex high-resolution spectrometer.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If Fourier-based methods with scanning elements are used to achieve high spectral resolution, then measurement precision is improved, but measurement time increases

Engineering Contradiction:
Improvespectral resolutionVSAvoidmeasurement time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The patent performs measurements at a limited number of discrete positions along the optical path rather than continuously scanning the entire range. By selecting specific key positions for measurement, the system achieves sufficient spectral resolution without the time penalty of a complete continuous scan.

Inventive Principle:
Principle #16Partial or excessive action

Solution Approach 2:

The patent pre-determines the optimal measurement positions along the optical path based on the expected spectral features. This preliminary planning allows the system to focus measurements only at critical positions, reducing total measurement time while maintaining spectral resolution.

Inventive Principle:
Principle #10Preliminary action

3Measurement precision

If longer wavelengths are used to reduce oscillation frequency, then spectral features become easier to resolve, but sensitivity is lost and system complexity increases

Engineering Contradiction:
Improvespectral feature resolutionVSAvoidmeasurement sensitivity
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent maintains the original wavelength parameters for measurement but changes the measurement approach by taking multiple measurements at different spatial positions. This allows the system to resolve spectral features through the multi-position measurement strategy rather than by changing to longer wavelengths, thereby preserving measurement sensitivity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances measurement sensitivity and accuracy for thick structures by resolving fast spectral features, providing stable and detailed characterization of wafer patterns.

Implementation Method 1

The interference of reflections from surfaces at different heights causes oscillation of the measured reflection as a function of wavelength

Methodology Applied
Scientific EffectInterference: Interference

Data Source

PatentUS20260009637A1Coherent spectroscopy for TSV
Publication Date: 2026.01.08 NOVA MEASURING INSTR LTD
  • US20260009637A1 patent drawing
  • US20260009637A1 patent drawing
  • US20260009637A1 patent drawing

AI summary

A system and methods for OCD metrology are provided including setting an interferometry mirror of the system at each of multiple positions z, wherein at each position the mirror reflection is Optical-Path-Difference (OPD) matched with reflection from the at least one reflective surface, and measuring interferometer spectra Imeasured, with the mirror at each of the multiple positions; then fitting the multiple measured interferometer spectra to an equation for Imeasured, to solve for non-z-dependent parameters of the equation, leaving a z-dependent function of the wave number k, having fully coherent and partially coherent terms; and removing the partially coherent terms of the function to derive a fully coherent field for characterizing the OCD structure.