Open-Cavity Semiconductor Packaging With Exposed Conductive Feeds
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Solution Overview
Problem
Existing semiconductor device packaging configurations face challenges in accommodating sophisticated features and applications, leading to potential reliability issues, performance degradation, and increased costs.
Innovation Solution
A semiconductor device with an open cavity is developed, featuring a semiconductor die and a sacrificial blank with an attached routing structure, encapsulated with an encapsulant. The sacrificial blank is etched to form a cavity, exposing conductive feeds for external component attachment, and a package substrate interconnects the semiconductor die with the routing structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional semiconductor device packaging configurations are used, then manufacturing processes are simpler, but reliability and performance are reduced
Solution Approach 1:
The packaging structure is segmented into distinct functional zones: an open cavity region for component mounting, an encapsulant region for protection, and a substrate region for electrical interconnection. This segmentation allows each region to be optimized for its specific function, improving overall device reliability while maintaining manufacturability through standardized process steps for each zone.
Solution Approach 2:
The patent transitions from traditional planar packaging to a three-dimensional structure with vertical cavity walls and multi-level component placement. The open cavity extends vertically into the encapsulant, creating additional spatial dimensions for component mounting and signal routing, which improves performance without significantly increasing manufacturing complexity.
2Adaptability or versatility
If sophisticated features are added to semiconductor devices, then functionality is improved, but manufacturing costs increase
Solution Approach 1:
The open cavity structure serves multiple functions simultaneously: it provides mechanical support for external components, enables electrical interconnection through exposed conductive feeds, allows thermal management pathways, and facilitates signal routing. This multi-functionality reduces the need for separate specialized structures, thereby lowering manufacturing costs while maintaining sophisticated features.
Solution Approach 2:
The patent merges the cavity formation, component mounting surface, and electrical interconnection structure into a single integrated packaging feature. The conductive feeds are formed as part of the substrate structure and extend into the cavity, eliminating the need for separate connection elements and reducing overall manufacturing steps and costs.
3Ease of operation
If conductive feeds are exposed for external component attachment, then integration capability is improved, but structural protection is reduced
Solution Approach 1:
The encapsulant material provides protective coverage over most of the device structure, while the open cavity region intentionally lacks encapsulant to expose conductive feeds for component attachment. This local differentiation allows the structure to simultaneously provide protection where needed and accessibility where required, maintaining both structural integrity and ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances integration with external components, improving reliability, performance, and reducing costs by allowing for better integration and exposure of conductive feeds within the open cavity.
Implementation Method 1
The exposed surface of the sacrificial blank is etched to form the cavity in the encapsulant
Data Source
AI summary
A method of forming a semiconductor device is provided. The method includes placing a semiconductor die on a carrier substrate and placing a sacrificial blank on the carrier substrate with a routing structure attached to the sacrificial blank. At least a portion of the semiconductor die, sacrificial blank, and routing structure are encapsulated with an encapsulant. The carrier substrate is separated from a first side of the encapsulated semiconductor die, sacrificial blank, and routing structure to expose a surface of the sacrificial blank. The sacrificial blank is etched to form a cavity in the encapsulant and expose a portion of the routing structure exposed through the cavity.