Open-Cavity Semiconductor Package for Accessible Routing Feeds

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Solution Overview

Problem

Existing semiconductor device packaging configurations face challenges in accommodating sophisticated features and applications, leading to potential reliability issues, performance limitations, and increased costs.

Innovation Solution

A semiconductor device with an open cavity is developed, featuring a semiconductor die and a routing structure partially encapsulated with an encapsulant. The cavity is formed in the encapsulant to expose conductive feeds, allowing for the attachment of external components such as additional semiconductor dies, sensors, or connectors, with interconnection via a package substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional encapsulation methods are used to protect the routing structure, then reliability is improved through protection, but accessibility to conductive feeds is lost and device complexity increases

Engineering Contradiction:

Improveprotection of routing structureVSAvoidaccessibility to conductive feeds

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The encapsulant is segmented to form a cavity that exposes specific portions of the routing structure while maintaining encapsulation of other areas. This segmentation allows the conductive feeds to be accessible for external component attachment while the rest of the routing structure remains protected by the encapsulant, thus resolving the contradiction between protection and accessibility.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If sophisticated features are added to semiconductor devices, then functionality is improved, but packaging complexity and costs increase

Engineering Contradiction:

ImprovefunctionalityVSAvoidpackaging configuration

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The encapsulant with cavity structure serves multiple functions: it provides mechanical protection to the routing structure, creates accessible openings for external component attachment, and maintains structural integrity. This multi-functionality allows sophisticated features to be integrated without proportionally increasing packaging complexity, as the same encapsulant structure accomplishes multiple goals.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If the routing structure is fully encapsulated, then protection is improved, but integration with external components becomes difficult

Engineering Contradiction:

ImproveprotectionVSAvoidintegration with external components

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The encapsulant is configured with different properties in different locations: areas with cavities provide accessibility for external component integration, while areas without cavities provide full protection. This local differentiation of encapsulation quality allows the structure to simultaneously achieve protection and ease of integration where needed.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250029947A1Semiconductor device with open cavity and method therefor

Publication Date: 2025.01.23 NXP USA INC

AI summary

A method of forming a semiconductor device is provided. The method includes placing a semiconductor die and routing structure on a carrier substrate. At least a portion of the semiconductor die and routing structure are encapsulated with an encapsulant. A cavity formed in the encapsulant. A top portion of the routing structure is exposed through the cavity. A conductive trace is formed to interconnect the semiconductor die with the routing structure.